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Micromechanical component and method for manufacturing the same

A technology of micromechanical components and some components, which is applied in the direction of manufacturing microstructure devices, processes for producing decorative surface effects, microstructure technology, etc., can solve problems such as error signals, and achieve easy mechanical properties, good quality, and reduced effect of size

Pending Publication Date: 2020-01-03
ROBERT BOSCH GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This wiggling motion is similar to the first example leading to undesired false signals

Method used

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  • Micromechanical component and method for manufacturing the same
  • Micromechanical component and method for manufacturing the same
  • Micromechanical component and method for manufacturing the same

Examples

Experimental program
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Embodiment Construction

[0029] figure 1 A rotational speed sensor 1 according to the prior art is shown. When manufacturing such a sensor 1 , the silicon structure 2 is usually produced by depositing a thick silicon layer and then etching this layer. Upon etching, trenches 3 (channel trenches) with a high aspect ratio are created in the silicon layer. The sacrificial layer arranged below the thick silicon layer is removed in a second step, so that a movement of the silicon structure 2 relative to the substrate 10 becomes possible due to the vertical gap 4 produced. A thin polysilicon layer can also be arranged below the movable structure 2 , from which polysilicon layer is produced by etching further elements 5 , 6 which can be used, for example, as suspensions 5 or electrodes 6 .

[0030] figure 2 A further rotational speed sensor 1 according to the prior art is shown. In the embodiment shown, the conductor track 7 is produced by etching from a thin polysilicon layer. The movable structure 2 o...

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PUM

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Abstract

The invention relates to a micromechanical component (1), especially to a rotating speed sensor. The micromechanical component comprises a substrate (10) having a main extension plane and at least onemass resonator (12), wherein the mass oscillator (12) is mounted such that it can oscillate relative to the substrate (10) by means of one or more spring elements (13), wherein the at least one spring element (13) has a first spring part element (14) and a second spring part element (15), which are arranged one above the other in a vertical direction (18) perpendicular to the main extension planeand are spaced apart from each other in the vertical direction (18). The invention relates to a method for producing a micromechanical component (1).

Description

technical field [0001] The invention relates to a micromechanical component and a method for producing the micromechanical component. Background technique [0002] Micromechanical components and methods for their production are known in the prior art in various embodiments. In the publication DE 195 37 814 A1, for example, a method for producing a micromechanical sensor for acceleration sensors and rotational speed sensors is described. Using this and similar methods, silicon structures are produced that also move, the motion of which is measured by determining changes in capacitance. A characteristic and further discussion of this type of method is that in a first step the movable silicon structure is produced by an etching process, wherein trenches are produced in the silicon layer with a large aspect ratio (DE 42 41 045 C1). In a second step the sacrificial layer (mostly an oxide layer, see eg DE 43 17 274 A1) below the silicon layer is removed. Thus, a silicon structu...

Claims

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Application Information

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IPC IPC(8): B81B3/00B81C1/00G01C19/5733
CPCB81B3/007B81B3/0027B81C1/00134B81C1/00658G01C19/5733B81B2201/0242B81B2203/0163B81B3/0059
Inventor J·赖因穆特R·毛尔
Owner ROBERT BOSCH GMBH