Link solder ball linking device for integrated circuit packaging
A technology for integrated circuits and welding devices, applied in the manufacturing of circuits, electrical components, semiconductor/solid-state devices, etc., can solve problems such as low efficiency and complex operation, and achieve the effect of improving efficiency
Inactive Publication Date: 2020-01-03
安徽国晶微电子有限公司
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Problems solved by technology
Package substrates typically have two sets of connection points, a first set for connection to the die or dies, and a second, less densely packed set for connection to the board, existing link solder ball arrangements require manual Soldering and encapsulating the circuit board with a welding torch is complicated and inefficient
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[0021] The present invention is described in further detail now in conjunction with accompanying drawing. These drawings are all simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, so they only show the configurations related to the present invention.
[0022] In the present invention, unless otherwise clearly specified and limited, terms such as "installation", "connection", "connection" and "fixation" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection , or integrated; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two components or the interaction relationship between two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific...
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The invention discloses a link solder ball linking device for integrated circuit packaging. The device comprises a welding device, a transmission device, a placing device and a base, wherein a slidinggroove is formed on the base, the placing device is arranged in the sliding groove in a sliding mode, the welding device used for being connected with a solder ball is arranged above the placing device, and the transmission device used for pushing the placing device to move is arranged on a side face of the placing device. The link solder ball device for integrated circuit packaging is advantagedin that a vertical electromagnetic guide rail and a transverse electromagnetic guide rail can be matched through an infrared sensor so that a welding gun can correspond to the position needing to bewelded all the time, an objective table can be conveniently pushed by the transmission device in the sliding groove, welding and next-step work are integrally operated, welding efficiency is improved,and welding production efficiency is improved.
Description
technical field [0001] The invention relates to the technical field of circuit boards, in particular to a connecting solder ball device for integrated circuit packaging. Background technique [0002] The position of integrated circuit packaging in the pyramid of electronics is both the apex and the base of the pyramid. There is good reason to say that it is in both positions at the same time. ICs represent the cutting edge of electronics in terms of the density of electronic components such as transistors. But the IC is a starting point, a basic building block that forms the basis of most electronic systems in our lives. Similarly, an IC is not just a single circuit board or a basic electronic structure. The types of ICs vary widely (analog circuits, digital circuits, radio frequency circuits, sensors, etc.), so the needs and requirements for packaging are also different. This article provides a comprehensive review of IC packaging technology, introducing in broad strokes...
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IPC IPC(8): H01L21/67
CPCH01L21/67144H01L21/67259
Inventor 庞士德阮怀其
Owner 安徽国晶微电子有限公司