Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Rapid drying device for PCBs

A PCB circuit board, fast drying technology, applied in the direction of printed circuit drying, drying, dryer, etc., can solve the problem of low flexibility, low convenience and low heat utilization rate of PCB circuit board drying device Advanced problems, to achieve the effect of preventing poor braking effect, avoiding energy waste, and good braking effect

Inactive Publication Date: 2020-01-03
云梭(宁波)科技有限公司
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a quick drying device for PCB circuit boards in order to solve the problems (the flexibility of the PCB circuit board drying device is not high, the utilization rate of heat is not high, and the convenience is not high).

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Rapid drying device for PCBs
  • Rapid drying device for PCBs
  • Rapid drying device for PCBs

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0035]In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, or in a specific orientation. construction and operation, and therefore cannot be construe...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a rapid drying device for PCBs, which comprises a drying chamber, a device base and a degassing chamber. The bottom of the drying chamber is fixedly connected with a heating chamber. One side of the heating chamber is fixedly connected with a power line. The bottom of the heating chamber is fixedly connected with the device base. The other side of the top of the device baseis fixedly connected with the degassing chamber. The outer wall of the drying chamber is fixedly connected with an air guide pipe fixing groove. A drying plate is connected into the drying chamber inan embedded mode. The surface of the drying plate is fixedly connected with a PCB fixing groove. The top of the heating chamber is fixedly connected with a heat conducting plate. The heat conductingplate improves the energy utilization rate of the device body. A shock absorption layer improves the stability of the device body in the moving process. A rotatable drying mechanism improves the energy utilization rate and flexibility of the device body. An odor removing mechanism plays a role in protecting the environment. A moving mechanism improves the convenience of the device body. The rapiddrying device for PCBs is suitable for PCB drying and has a wide development prospect in the future.

Description

technical field [0001] The invention belongs to the technical field of PCB circuit board processing, and in particular relates to a rapid drying device for PCB circuit boards. Background technique [0002] PCB circuit board, also known as printed circuit board, is a provider of electrical connections for electronic components. Its processing process is extremely complicated. After processing, it is necessary to use a professional drying device to dry the paint and moisture on the surface. [0003] The flexibility of the existing PCB circuit board drying device is not high, resulting in certain limitations in the use of the device, and the low utilization rate of heat in the existing device, resulting in waste of energy. The existing PCB circuit The convenience of the board drying device is not high, and it is cumbersome to move, which reduces the work efficiency of the relevant staff. The odor gas generated by the existing PCB circuit board drying device cannot be eliminated...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/22F26B11/04F26B25/10B01D53/75B01D53/82B01D53/86B01D46/10
CPCB01D46/0038B01D46/10B01D53/75B01D53/82B01D53/86F26B11/04F26B21/001F26B25/10H05K3/227
Inventor 张艳
Owner 云梭(宁波)科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products