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MEMS piezoelectric ultrasonic transducer with Helmholtz resonant cavity

An ultrasonic transducer, piezoelectric ultrasonic technology, applied in the direction of fluid using vibration, etc., can solve the problems of large device size and low resonance frequency, and achieve the effect of increasing the resonance frequency and reducing the volume

Active Publication Date: 2020-01-14
武汉敏声新技术有限公司
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Problems solved by technology

However, in general, the resonant frequency of the Helmholtz cavity resonator is low, and when matched with the resonant frequency of the pMUT, the resonant frequency of the PSRC is lower, and the size of the device is larger

Method used

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  • MEMS piezoelectric ultrasonic transducer with Helmholtz resonant cavity
  • MEMS piezoelectric ultrasonic transducer with Helmholtz resonant cavity
  • MEMS piezoelectric ultrasonic transducer with Helmholtz resonant cavity

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Embodiment Construction

[0027] Such as figure 1 and figure 2 , the MEMS piezoelectric ultrasonic transducer includes a pMUT 11 and a Helmholtz resonant cavity 16 formed on the substrate layer 1 of silicon material, the resonant frequency of the Helmholtz resonant cavity 16 is consistent with the resonant frequency of the pMUT11, and the ultrasonic transducer The sound pressure of the sound wave emitted by the transducer will be greatly enhanced by the amplification of the Helmholtz resonant cavity 16, thereby improving the energy conversion efficiency of the ultrasonic transducer.

[0028] Such as Figure 3-6 , in order to reduce the volume of the Helmholtz resonator 16 to increase the resonance frequency of the Helmholtz resonator 16, the disclosure sets the height of the first cavity 6 of the Helmholtz resonator 16 to be greater than the MEMS pressure The maximum amplitude of the electro-ultrasonic transducer, and the middle part of the first cavity 6 sinks to form the second cavity 9 . In addi...

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Abstract

The invention discloses a MEMS piezoelectric ultrasonic transducer. A piezoelectric ultrasonic transducer (11) is formed on a substrate layer (1); a Helmholtz resonant cavity (16) is formed in the substrate layer (1); the resonant frequency of the Helmholtz resonant cavity (16) is consistent with the resonant frequency of the piezoelectric ultrasonic transducer (11); the Helmholtz resonant cavity(16) comprises a first cavity (6) whose height is higher than the maximum vibration amplitude of the piezoelectric ultrasonic transducer (11); the middle part of the first cavity (6) is sunk to form asecond cavity (9); and the first cavity (6) communicates with the external through a through hole (7) in the piezoelectric ultrasonic transducer (11). The volume of the Helmholtz resonant cavity is obviously reduced; and the resonant frequency of the Helmholtz resonant cavity is improved. The resonant frequency of the transducer is matched with the resonant frequency of the Helmholtz resonant cavity to finally improve the resonant frequency of the MEMS piezoelectric ultrasonic transducer.

Description

technical field [0001] The disclosure belongs to the technical field of ultrasonic transducers, and relates to a MEMS piezoelectric ultrasonic transducer with a Helmholtz resonant cavity. Background technique [0002] Ultrasonic transducers are transducer devices that can convert electrical energy into acoustic energy and convert acoustic energy into electrical energy, so ultrasonic transducers can be used for both transmitting and receiving ultrasonic waves. At present, the most widely used ultrasonic transducers are based on bulk piezoelectric transducers. Bulk piezoelectric transducers mainly use the vibration of piezoelectric ceramics. Since the resonance frequency is only related to the thickness of piezoelectric ceramics, it is difficult to Fabricate ultrasonic transducers with different resonant frequencies. In addition, the thickness of piezoelectric ceramics of this kind of transducer is difficult to control at sub-micron precision, so it is not suitable for high f...

Claims

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Application Information

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IPC IPC(8): B06B1/06
CPCB06B1/0603B06B2201/55
Inventor 孙成亮朱伟吴志鹏王磊胡博豪林炳辉周禹
Owner 武汉敏声新技术有限公司
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