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Manufacturing method of wave-absorbing material and wave-absorbing material adhesive tape structure

A technology of a wave absorbing material and a manufacturing method, which is applied in the field of wave absorbing materials to achieve the effects of high viscosity, smooth and flat surface, and meeting rigid requirements

Inactive Publication Date: 2020-01-14
昆山汉品电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the rapid development of science and technology and the upgrading of electronic products, while people pursue high efficiency, they also begin to consider the hazards of various electromagnetic waves to the environment, the interior of the human body and electronic components themselves. Since these hazards have seriously affected the normal life of human beings, only metals, etc. Shielding materials are far from being sufficient

Method used

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  • Manufacturing method of wave-absorbing material and wave-absorbing material adhesive tape structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Coating front stage: Use a glue melter to stir EPDM rubber and cyclohexanone at a ratio of 1:2 at a temperature of 70°C and a stirring speed of 100r / min until the colloid is fully dissolved;

[0031] After dissolving, let it stand at room temperature for 24 hours, then add BYK wetting and dispersing agent to EPDM rubber in a ratio of 0.8:1, flake sendust magnetic powder and EPDM rubber in a ratio of 6:1, and then add Cyclohexanone, add cyclohexanone until the total amount of cyclohexanone added is 1 time of the total weight of EPDM rubber and sheet sendust magnetic powder, stir at room temperature for 1 hour, the stirring speed is 100r / min, stir After the completion, it can be coated on the machine;

[0032] Coating and vulcanization process: The release film with a thickness of 0.05um is used as the base material, and the coating process is adopted. The temperature of each section of the oven is set at 85°C, and the speed is 0.5M / min. A uniform layer is formed on the r...

Embodiment 2

[0034] Coating front stage: Use a melter to mix polyurethane and methyl ethyl ketone at a ratio of 1:3 at a temperature of 80°C and a stirring speed of 90r / min until the colloid is fully dissolved;

[0035] After dissolving, let stand at room temperature for 30 hours, then add BYK Wetting and Dispersing Agent to polyurethane at a ratio of 0.9:1, flake sendust magnetic powder and polyurethane at a ratio of 10:1, then add methyl ethyl ketone, and add methyl ethyl ketone to The total amount of methyl ethyl ketone added is 1.2 times the total weight of polyurethane and flaky sendust magnetic powder. Stir at room temperature for 1 hour at a stirring speed of 300r / min. After the stirring is completed, it can be coated on the machine;

[0036] Coating and vulcanization process: The release film with a thickness of 0.05um is used as the base material, and the coating process is adopted. The temperature of each section of the oven is set at 120°C, and the speed is 1.5M / min. A uniform la...

Embodiment 3

[0038] Coating front stage: Use a melter to mix polyurethane and xylene at a ratio of 1:5, at a temperature of 90°C, and at a stirring speed of 95r / min until the colloid is fully dissolved;

[0039] After dissolving, let stand at room temperature for 48 hours, then add BYK Wetting and Dispersing Agent to polyurethane at a ratio of 0.9:1, flake sendust magnetic powder and polyurethane at a ratio of 8:1, then add xylene, and add xylene to The total amount of xylene added is 1.2 times the total weight of polyurethane and flaky sendust magnetic powder. Stir at room temperature for 1 hour at a stirring speed of 500r / min. After the stirring is completed, it can be coated on the machine;

[0040] Coating and vulcanization process: use the release film with a thickness of 0.05um as the base material, adopt the coating process, set the temperature of each section of the oven at 135°C, and the speed of 1.3M / min to form a uniform layer on the release surface of the release layer However,...

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Abstract

The invention discloses a wave-absorbing material manufacturing method and a wave-absorbing material adhesive tape structure. The wave-absorbing material manufacturing method comprises the following steps: stirring a resin and a solvent according to a ratio of 1: 2-1: 5 at a temperature of 70-90 DEG C by using a glue melting machine until glue full dissolving is realized; after dissolving, standing for 24 to 48 hours at room temperature; and then adding a special dispersing agent at a special dispersing agent to pure resin ratio of 0.8-1: 1, adding a magnetic powder at a magnetic powder to pure resin ratio of 6-10: 1, and adding a solvent until the total adding amount of the solvent is 1 to 1.2 times of that of the resin and the magnetic powder, stirring at room temperature for 1 hour, taking a release film with the thickness of 0.05 <mu>m as a base material; carrying out coating process, setting the temperature of each section of a drying oven to be 85-135 DEG C, and the speed to be 0.5-1.5 M / min, forming a layer of uniform wave-absorbing material with a rough surface on the release surface of the release film, and carrying out surface processing until an obtained surface is smooth. In manufacturing of the wave-absorbing material, the resin is dissolved firstly, and then is mixed with the magnetic powder through stirring, so that the damage to the morphology and the influenceon the performance of the sheet-shaped magnetic powder are avoided, and meanwhile, the use of the sheet-shaped iron-silicon-aluminum magnetic powder can also meet the necessary requirements on the wave-absorbing material with different magnetic conductivities.

Description

technical field [0001] The invention relates to the field of wave-absorbing materials, in particular to a method for manufacturing the wave-absorbing material and a tape structure of the wave-absorbing material. Background technique [0002] With the rapid development of science and technology and the upgrading of electronic products, while people pursue high efficiency, they also begin to consider the hazards of various electromagnetic waves to the environment, the interior of the human body and electronic components themselves. Since these hazards have seriously affected the normal life of human beings, only metals, etc. Shielding materials are far from enough. In order to reduce these damages, it is especially necessary to develop a wave-absorbing material. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a method for making a wave-absorbing material, which has a smooth surface, is not easy to break, warp an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L23/16C08L75/04C08K7/00C08K3/08C08K3/02C09J7/24C09J7/25
CPCC08K3/02C08K3/08C08K7/00C08K2003/023C08K2003/0812C08K2003/0856C08K2201/01C09J7/243C09J7/25C08L23/16C08L75/04
Inventor 朱娜施艳萍
Owner 昆山汉品电子有限公司
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