Copper plating method of metal surface

A metal surface, copper plating technology, applied in the direction of metal material coating process, liquid chemical plating, coating, etc., can solve the problems of scratches and damages, inconvenient modulation and low efficiency of the outer surface coating, and achieve uniform film, The effect of good electrical conductivity and smooth light intensity

Inactive Publication Date: 2020-01-14
BEIJING SHUGUANG AERO ELECTRICAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, during the installation process of some copper-plated parts, it is found that the coating on the outer surface is scratched and damaged, and local repairs are required

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0027] Example 1

[0028] The contact end plate material is 10 steel. After the overall copper plating, the copper plating film on the contact surface is removed by machine addition, and the copper plating is chemical method at the place without film.

[0029] The solutes of the repair solution are copper sulfate, thiourea and sodium hypophosphite, and the solvent of the repair solution is water; the mass ratio of copper sulfate to water is 20:1, and the unit is g / L; the mass of thiourea and water The volume ratio of sodium hypophosphite is 0.2:1, and the unit is g / L; the mass ratio of sodium hypophosphite to water is 3:1, and the unit is g / L.

[0030] Further, the time for the reaction between the copper-free part and the repair solution is 40 seconds.

[0031] Further, the contact between the copper-free portion and the repair liquid is carried out by coating.

[0032] Further, the removal of copper plating on the metal surface is achieved by machining.

[0033] Further, ...

Example Embodiment

[0034] Example 2

[0035] The material of the contact sheet is 45 steel. After the overall copper plating, the copper plating film on the contact surface is removed by machine addition, and the copper plating is chemical method at the place without film.

[0036] The solutes of the repair solution are copper sulfate, thiourea and sodium hypophosphite, and the solvent of the repair solution is water; the mass ratio of copper sulfate to water is 25:1, and the unit is g / L; the mass of thiourea and water The volume ratio of sodium hypophosphite is 0.3:1, and the unit is g / L; the mass ratio of sodium hypophosphite to water is 4:1, and the unit is g / L.

[0037] Further, the reaction time between the copper-free part and the repair solution is 35 seconds.

[0038] Further, the contact between the copper-free portion and the repair liquid is carried out by coating.

[0039] Further, the removal of copper plating on the metal surface is achieved by machining.

[0040] Further, the h...

Example Embodiment

[0041] Example 3

[0042] The material is 20 steel. After the overall copper plating, the copper plating film on the contact surface is removed by machine addition, and the copper plating is chemical method at the place without film.

[0043] The solutes of the repair solution are copper sulfate, thiourea and sodium hypophosphite, and the solvent of the repair solution is water; the mass ratio of copper sulfate to water is 30:1, and the unit is g / L; the mass of thiourea and water The volume ratio of sodium hypophosphite is 0.4:1, and the unit is g / L; the mass ratio of sodium hypophosphite to water is 5:1, and the unit is g / L.

[0044] Further, the time for the reaction between the copper-free part and the repair solution is 30 seconds.

[0045] Further, the contact between the copper-free portion and the repair liquid is carried out by coating.

[0046] Further, the removal of copper plating on the metal surface is achieved by machining.

[0047] Further, the heating temper...

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PUM

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Abstract

The invention relates to a copper plating method of a metal surface. A non-copper-plated part and a repair solution are in contact to be subjected to a chemical reaction, during the chemical reaction,the heating temperature is 30 to 40 DEG C, the non-copper-plated part and the repair solution are subjected to washing and drying after the reaction, a solute of the repair solution comprises coppersulfate, thiourea and sodium hypophosphite, and a solvent of the repair solution is water. The new method of rapid copper plating can be achieved, film forming is uniform, the light intensity is flat,and the conductive property is good.

Description

technical field [0001] The invention relates to the technical field of metal surface treatment, in particular to a method for copper plating on a metal surface, and more particularly to a method for repairing and repairing a copper plated surface. Background technique [0002] At present, some copper-plated parts are found to be scratched and damaged on the outer surface during the installation process, and local repairs are required. However, the current copper-plated film local damage repair solution is complex and inconvenient to adjust, and the repair method is high in cost and low in efficiency. SUMMARY OF THE INVENTION [0003] The purpose of the present invention is to provide a copper plating repair solution and simplify the copper plating repair process. [0004] The technical scheme of the present invention is: [0005] Technical solution: to provide a copper plating method on a metal surface, the copper plating method includes a first copper plating process and...

Claims

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Application Information

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IPC IPC(8): C23C18/38C23C18/16
CPCC23C18/1603C23C18/1637C23C18/1655C23C18/38
Inventor 李忠山石磊赵仲严
Owner BEIJING SHUGUANG AERO ELECTRICAL
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