Copper plating method of metal surface
A metal surface, copper plating technology, applied in the direction of metal material coating process, liquid chemical plating, coating, etc., can solve the problems of scratches and damages, inconvenient modulation and low efficiency of the outer surface coating, and achieve uniform film, The effect of good electrical conductivity and smooth light intensity
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Embodiment 1
[0028] The contact end plate material is 10 steel. After the overall copper plating, the copper plating film on the contact surface is removed by machine addition, and the copper plating is chemical method at the place without film.
[0029] The solutes of the repair solution are copper sulfate, thiourea and sodium hypophosphite, and the solvent of the repair solution is water; the mass ratio of copper sulfate to water is 20:1, and the unit is g / L; the mass of thiourea and water The volume ratio of sodium hypophosphite is 0.2:1, and the unit is g / L; the mass ratio of sodium hypophosphite to water is 3:1, and the unit is g / L.
[0030] Further, the time for the reaction between the copper-free part and the repair solution is 40 seconds.
[0031] Further, the contact between the copper-free portion and the repair liquid is carried out by coating.
[0032] Further, the removal of copper plating on the metal surface is achieved by machining.
[0033] Further, the heating temperat...
Embodiment 2
[0035] The material of the contact sheet is 45 steel. After the overall copper plating, the copper plating film on the contact surface is removed by machine addition, and the copper plating is chemical method at the place without film.
[0036] The solutes of the repair solution are copper sulfate, thiourea and sodium hypophosphite, and the solvent of the repair solution is water; the mass ratio of copper sulfate to water is 25:1, and the unit is g / L; the mass of thiourea and water The volume ratio of sodium hypophosphite is 0.3:1, and the unit is g / L; the mass ratio of sodium hypophosphite to water is 4:1, and the unit is g / L.
[0037] Further, the reaction time between the copper-free part and the repair solution is 35 seconds.
[0038] Further, the contact between the copper-free portion and the repair liquid is carried out by coating.
[0039] Further, the removal of copper plating on the metal surface is achieved by machining.
[0040] Further, the heating temperature f...
Embodiment 3
[0042] The material is 20 steel. After the overall copper plating, the copper plating film on the contact surface is removed by machine addition, and the copper plating is chemical method at the place without film.
[0043] The solutes of the repair solution are copper sulfate, thiourea and sodium hypophosphite, and the solvent of the repair solution is water; the mass ratio of copper sulfate to water is 30:1, and the unit is g / L; the mass of thiourea and water The volume ratio of sodium hypophosphite is 0.4:1, and the unit is g / L; the mass ratio of sodium hypophosphite to water is 5:1, and the unit is g / L.
[0044] Further, the time for the reaction between the copper-free part and the repair solution is 30 seconds.
[0045] Further, the contact between the copper-free portion and the repair liquid is carried out by coating.
[0046] Further, the removal of copper plating on the metal surface is achieved by machining.
[0047] Further, the heating temperature for the reacti...
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