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Method for measuring thickness of plating layer in plating process, and plating equipment

A coating and equipment technology, applied in measuring devices, electrolysis processes, instruments, etc., can solve the problems of wasting time and manpower, destroying packaging substrates, impossible to monitor packaging substrates, etc., and achieve the effect of reducing costs

Inactive Publication Date: 2020-01-14
SHENNAN CIRCUITS
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Problems solved by technology

[0003] The inventors of the present application have found in long-term research that the above two measurement methods have certain defects. The first method is inefficient and needs to destroy the package substrate, resulting in waste, so it is impossible to monitor every package substrate , the second method requires manual measurement after the electroplating is completed. Among them, the random measurement cannot monitor each package substrate 100%, the full measurement wastes time and manpower, and the efficiency is low. In addition, the copper thickness cannot be monitored in real time during the processing of the package substrate, resulting in a lot of scrap

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  • Method for measuring thickness of plating layer in plating process, and plating equipment
  • Method for measuring thickness of plating layer in plating process, and plating equipment
  • Method for measuring thickness of plating layer in plating process, and plating equipment

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Embodiment Construction

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0023] refer to figure 1 , figure 1 It is a structural schematic diagram of an embodiment of the coating equipment of the present application, and the coating equipment includes: a first weighing device 10 , a coating device 20 , a second weighing device 30 and a data processing device 40 .

[0024] The first weighing device 10 is used to measure the weight of the product to be operated, the coating device 20 is used to process the product to be operated, to ...

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Abstract

The invention discloses a method for measuring thickness of a plating layer in the plating process, and plating equipment. The plating equipment comprises a first weighing device, a plating device, asecond weighing device and a data processing device, wherein the first weighing device is used for measuring weight of a to-be-operated product; the plating device is used for processing the to-be-operated product, so as to form a plating layer on the to-be-operated product; the second weighing device is used for measuring weight of the operated product; the data processing device is connected with the first weighing device and the second weighing device, and is used for calculating the thickness of the plating layer according to the weight of the to-be-operated product, the weight of the operated product and a total coverage area of the plating layer, and the thickness of the plating layer can be automatically monitored in the plating process by means of the plating equipment.

Description

technical field [0001] The present application relates to the technical field of coating, in particular to a method and coating equipment for measuring the thickness of coating during the coating process. Background technique [0002] The electroplating process is an electrochemical reaction. In a salt solution containing pre-plated metal, the metal to be plated is used as the cathode, so that the cations of the pre-plated metal in the plating solution are deposited on the surface of the substrate. Packaging substrate is a printed circuit board mainly made of organic materials used in electronic packaging. At present, there are two main methods for measuring the coating on the surface of the packaging substrate: the first is to slice and measure after the electroplating is completed, and the second is to measure the coating on the surface of the packaging substrate. In the middle is the use of contact copper thickness measurement equipment. [0003] The inventors of the pre...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B21/08C25D21/12
CPCC25D21/12G01B21/08
Inventor 谷新王亮
Owner SHENNAN CIRCUITS
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