Field circuit coupling method and device for direct-current electric field of multi-layer integrated circuit

Abstract

The embodiment of the invention discloses a field circuit coupling method and device for a direct-current electric field of a multi-layer integrated circuit. The method comprises: acquiring a multilayer integrated circuit direct-current electric field two-dimensional model simplified according to a three-dimensional model of a multilayer integrated circuit direct-current electric field, establishing a field domain solving equation set for the two-dimensional model of each layer through a finite element method, and forming an overall sparse matrix of the integrated circuit field domain solvingequation set; for an external circuit of the integrated circuit, establishing a symmetric positive definite external circuit equation set according to a super-node method; and combining the field domain solving equation set with the external circuit equation set, establishing a symmetrical positive definite unified solving equation set of field-circuit coupling, combining the equation sets by scanning the super nodes, and ending scanning if all the super nodes are scanned. Field circuit coupling can be accurately and completely carried out on the multi-layer integrated circuit direct-current electric field, and the design effect of multi-layer integrated circuit and chip packaging is improved.

Description

technical field [0001] The invention relates to the field of field-circuit coupling of a DC electric field of a multilayer integrated circuit, in particular to a field-circuit coupling method and device of a DC electric field of a multilayer integrated circuit. Background technique [0002] Due to the increase in packaging density of integrated circuits in the prior art, resulting in a high concentration of interconnection lines, this necessitates the use of multiple substrates. In the layout of the printed circuit, unforeseen design problems such as noise, stray capacitance, crosstalk, etc. have appeared. Therefore, integrated circuit printed circuit board design must focus on minimizing the length of signal lines and avoiding parallel routes. Obviously, in a single-panel, or even a double-panel, these demands cannot be satisfactorily answered due to the limited number of crossovers that can be achieved. In the case of a large number of interconnection and crossover requi...

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Problems solved by technology

[0004] However, in the process of implementing the present invention, the inventors found that in the prior art for the analysis of the electric field-circuit coupling (referred to as field-circuit coupling) of the DC electric field of the multilayer integrated circuit, when the equations are combined by scanning supernodes, it is easy to occur The omission of some super nodes leads to large errors in the scanning results, which in turn affects the accuracy and integrity of the field-circuit coupling method of the DC electric field of the multilayer integrated circuit, and affects the design effect of the multilayer integrated circuit and chip packaging

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