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Gas-cross detection method, device and readable storage medium for multi-station deposition process

A technology of deposition process and detection method, which is applied in the direction of measuring devices, electrical components, semiconductor/solid-state device testing/measurement, etc., which can solve the problem of affecting product wafer film deposition quality and product yield, and cannot find menu debugging gas phenomenon in time, etc. problems, to ensure the quality of film deposition and product yield

Active Publication Date: 2022-07-01
YANGTZE MEMORY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a multi-station deposition process cross-gas detection method, equipment and readable storage medium, which are used to solve the problems caused by the inability to find menu debugging in time in the prior art. The cross-gas phenomenon, which in turn affects the film deposition quality of product wafers and the problem of product yield

Method used

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  • Gas-cross detection method, device and readable storage medium for multi-station deposition process
  • Gas-cross detection method, device and readable storage medium for multi-station deposition process
  • Gas-cross detection method, device and readable storage medium for multi-station deposition process

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Embodiment 1

[0060] see Figure 1 to Figure 9 , the present embodiment provides a method for detecting cross gas in a multi-station deposition process, which is characterized in that it includes the following steps:

[0061] 1) Provide a multi-station deposition apparatus by which the multi-station deposition process is performed on one or more wafers, the multi-station deposition apparatus having multiple a station for accommodating a plurality of the wafers for a multi-station deposition process;

[0062] 2) performing film uniformity detection on the film deposited on the wafer surface that has completed the multi-station deposition process;

[0063] 3) gas supply flow detection is performed on the process gas supplied in the multi-station deposition process;

[0064] 4) According to the results of the detection of the uniformity of the thin film and the detection of the gas supply flow rate, it is determined whether there is a gas stream in the process of the multi-station deposition p...

Embodiment 2

[0081] This embodiment provides a gas-crossing detection device for a multi-station deposition process, which is characterized in that: it includes:

[0082] The film uniformity detection module is used to test the film uniformity of the film deposited on the wafer surface after the multi-station deposition process;

[0083] a gas supply flow detection module, which is used to detect the gas supply flow rate of the process gas supplied in the multi-station deposition process;

[0084] a controller, used for judging whether gas cross-flow occurs in the process of the multi-station deposition process according to the results of the film uniformity detection and the gas supply flow detection; the controller includes a memory and a processor, and the memory A computer program is stored, and the computer program is used by the processor to execute the gas cross-gas detection method described in the first embodiment.

[0085] Based on the cross-gas detection device for the multi-st...

Embodiment 3

[0092] This embodiment provides a computer-readable storage medium on which a computer program is stored, and is characterized in that: when the computer program is executed by a processor, the gas flow of the multi-station deposition process as described in the first embodiment is realized. Detection method.

[0093] As an example, those skilled in the art can understand that all or part of the processes in the methods of the above embodiments can be completed by instructing relevant hardware through a computer program, and the program can be stored in a computer-readable storage medium. When the program is executed, it may include the flow of the embodiments of the above-mentioned methods. Wherein, the storage medium can be a magnetic disk, an optical disk, a read-only memory (Read-Only Memory, ROM), a random access memory (Random Access Memory, RAM), a flash memory (Flash Memory), a hard disk (Hard Disk) Drive, HDD) or solid-state drive (Solid-State Drive, SSD), etc.; the ...

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Abstract

The present invention provides a method, device and readable storage medium for gas detection in a multi-station deposition process. The gas detection method includes the following steps: providing a multi-station deposition device, and detecting one or more samples by the multi-station deposition device. The multi-station deposition process is performed on multiple wafers, and the multi-station deposition equipment has multiple stations located in the same chamber for accommodating multiple wafers for the multi-station deposition process; Film uniformity detection; flow detection of the process gas supplied in the multi-station deposition process; according to the results of the film uniformity detection and the gas supply flow detection, it is judged whether there is a gas stream in the process of the multi-station deposition process. The invention introduces a new method, equipment and readable storage medium for detecting gas streaking in a multi-station deposition process, and by performing film uniformity detection and gas supply flow detection, timely discovers the occurrence of streaks in the multi-station deposition process. gas, thus ensuring the quality of film deposition and product yield.

Description

technical field [0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular, to a method, device and readable storage medium for cross-gas detection in a multi-station deposition process. Background technique [0002] In the semiconductor manufacturing process, the thin film deposition process is a key process. The equipment structure that sets up multiple stations in the same chamber to accommodate multiple wafers has been widely used because of its unique advantages in equipment cost control. Among them, the multi-station sequential deposition process (multi-station sequential deposition) controls multiple wafers to pass through each station in sequence for film deposition, and the obtained film deposition uniformity is better and the uniformity between wafers is not affected by the station position. . [0003] At present, in the multi-station deposition process, the process gas is supplied through a shower head above eac...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/66H01L21/67G01N27/04
CPCH01L22/12H01L22/20H01L21/67253G01N27/041
Inventor 周烽万先进左明光宋锐李远熊少游李远博
Owner YANGTZE MEMORY TECH CO LTD