Check patentability & draft patents in minutes with Patsnap Eureka AI!

Chip package structure and electronic device

A chip packaging structure, chip technology, applied in the direction of circuits, electrical components, electrical solid devices, etc., can solve the problems of unfavorable product ultra-thin development, occupying the overall thickness of the packaged product space, etc., to ensure the mechanical reliability of the leads, and achieve ultra- thinning effect

Active Publication Date: 2020-01-14
SHENZHEN GOODIX TECH CO LTD
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in this dispensing packaging method, the height of the protective glue needs to be higher than the height of the leads, thus occupying the overall thickness space of the packaged product, which is not conducive to the development of ultra-thin products

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chip package structure and electronic device
  • Chip package structure and electronic device
  • Chip package structure and electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0044] The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.

[0045] The embodiments of the present application can be applied to various chips (Microchip), also known as integrated circuits (integrated circuit, IC) or microcircuits (Microcircuit), which are usually manufactured on semiconductor wafers, through semiconductor integrated circuit technology, through Film deposition, doping, photolithography, etching and other steps prepare a circuit structure integrated with multiple semiconductor devices on a silicon wafer. The chips include but are not limited to sensor chips, power chips, signal processing chips, logic control chips, memory chips and the like.

[0046] In the embodiment of the present application, the chip may be a fingerprint sensor chip, which is used to receive fingerprint signals such as light wave signals, sound wave signals, or pressure signals carrying fingerprint info...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a chip package structure and an electronic device. The thickness of a chip package can be reduced, and thinning of chip package is realized. The chip package structure comprisesa chip, a substrate, a lead, and a lead protective glue. The lead is electrically connected to the chip and the substrate. The lead protective glue is used to support the lead, and the highest pointof the lead protective glue is not higher than the highest point of the upper edge of the lead.

Description

technical field [0001] The present application relates to the technical field of optical fingerprints, and more specifically, relates to a chip packaging structure and electronic equipment. Background technique [0002] At present, in the packaging process of electronic chips, two methods are generally adopted for lead packaging: injection molding (Molding) packaging and dispensing packaging. Among them, the common method of dispensing packaging is: using protective glue to completely wrap the first soldering point and the second soldering point of the lead wire and the lead wire, so as to play a protective role. Therefore, in this way of dispensing glue packaging, the height of the protective glue needs to be higher than the height of the leads, thus occupying the overall thickness space of the packaged product, which is not conducive to the development of ultra-thin products. Contents of the invention [0003] Embodiments of the present application provide a chip packag...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/49H01L23/31
CPCH01L24/48H01L23/3171H01L23/3185H01L2224/48091H01L2224/48228H01L2224/48491H01L23/49838H01L24/47H01L24/32H01L24/73H01L24/42H01L2224/48227H01L2224/05553H01L2224/8592H01L2224/18H01L2224/48106H01L2224/48471H01L2224/49175H01L2224/73265H01L2924/00H01L2224/48465H01L2224/49176H01L2924/00014H01L2224/05013H01L2224/48479H01L2224/45144H01L2224/45147H01L2224/45139H01L2224/45015H01L24/49H01L24/45H01L24/85H01L2224/32225G06V40/1329H01L2924/20751H01L2924/20752H01L2924/00012H01L27/14618H01L27/14678H01L31/02005H01L31/0203G06V40/1318
Inventor 董昊翔
Owner SHENZHEN GOODIX TECH CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com