Wafer driving device and method

Abstract

The invention discloses a wafer drying device and method. The wafer drying device comprises a spray header which is provided with at least one spray hole and is used for spraying a cleaning solution;a spraying switch which is used for controlling the spraying flow of the cleaning solution; a vacuum chuck which is located below the spraying head, wherein the vacuum chuck comprises a bearing suction plate and a shell, the shell and the bearing suction plate form a cavity of the vacuum chuck, the bearing suction plate is further provided with at least one through hole penetrating through the cavity, and the bearing suction plate is used for containing the wafer; and a spray gun, wherein the spray gun port of the spray gun is arranged above the bearing suction plate, and the spray gun is usedfor spraying nitrogen to dry the wafer. According to the wafer cleaning method, the problem of drying of the wafer after cleaning is solved, and the effects of not damaging the semiconductor structure of the wafer and improving the yield, quality and reliability of the wafer in the cleaning process are achieved.

Description

technical field [0001] Embodiments of the present invention relate to a wafer drying technology, and in particular to a wafer drying device and method. Background technique [0002] A semiconductor structure on a wafer, stacked with multiple layers of epitaxial wafers. After the wafer is cleaned / etched and washed with water, it needs to be dried to remove moisture on the surface of the wafer (usually deionized pure water). In the prior art, the drying process adopts the "dynamic drying" method, see figure 1 That is, the wafer is fixed on the carrier 111, and the moisture 114 on the wafer is quickly dried by rapidly rotating the carrier 111. The rotating speed of the carrier 111 can reach 2000rpm. Due to the existence of uneven pits 112 in the wafer, after the cleaning process, there is usually accumulated water in these pits, and it is difficult to dry the accumulated water 113 in the pits 112 by this method. Moreover, the semiconductor structure on the wafer is stacked b...

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Problems solved by technology

Due to the existence of uneven pits 112 in the wafer, after the cleaning process, there will usually be accumulated water in these pits, and it is difficult to dry the accumulated water 113 in the pits 112 by this method

Moreover, the semiconductor structure on the wafer is stacked by multi-layer epitaxial wafers, which generates a large centrifugal force (up to 4×10 6 Dyne), it is easy to cause greater stress to the semiconductor structure on the wafer, damage the internal structure of the semiconductor structure on the wafer, reduce the reliability and service life of the semiconductor structure on the wafer, and may directly make the epitaxial wafer The peeling displacement occurs, destroys the semiconductor structure on the wafer, and reduces the yield, quality and reliability of the wafer

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