Inductor component
A component and inductance technology, applied in the field of inductance components, can solve the problem of insufficient improvement of the Q value, and achieve the effect of improving the Q value
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no. 1 Embodiment approach
[0078] figure 1 It is a see-through perspective view showing the first embodiment of the inductance component. figure 2 It is an exploded perspective view of the inductor component. image 3 It is a cross-sectional view of the inductive component. Such as figure 1 , figure 2 , image 3 As shown, the inductance component 1 has a main body 10, a spiral coil 20 provided inside the main body 10, a first external electrode 30 and a second external electrode 40 provided on the main body 10 and electrically connected to the coil 20. in figure 1 Here, the body 10 is described transparently in order to easily understand the configuration. image 3 Yes figure 1 Section III-III.
[0079] The inductance component 1 is electrically connected to the wiring of a circuit board (not shown) via the first external electrode 30 and the second external electrode 40. The inductance component 1 is used, for example, as an impedance matching coil (matching coil) of a high-frequency circuit, and is use...
no. 2 Embodiment approach
[0108] Image 6 It is a cross-sectional view showing the second embodiment of the inductance component. The second embodiment is different from the first embodiment in the structure of the coil wiring. Hereinafter, the different structure will be described.
[0109] Such as image 3 with Figure 4 As shown, the coil wiring 21 of the first embodiment is composed of a single layer, but as Image 6 As shown, the coil wiring 21A of the second embodiment is composed of three coil conductor layers 25a, 25b, and 25c laminated in surface contact with each other. In addition, the coil wiring 21A may be composed of two or four or more coil conductor layers.
[0110] Specifically, the coil wiring 21A is formed in multiple layers. For example, a first groove is formed in the first insulating layer 11a, and the first coil conductor layer 25a is buried in the first groove. Thereafter, a second insulating layer 11b is formed on the first insulating layer 11a, a second groove is formed in the s...
no. 3 Embodiment approach
[0125] Picture 9 It is a cross-sectional view showing the third embodiment of the inductance component. The third embodiment is different from the second embodiment in the structure of the coil wiring. Hereinafter, the different structure will be described.
[0126] Such as Image 6 As shown, the coil wiring 21A of the second embodiment is composed of coil conductor layers 25a, 25b, and 25c having a rectangular cross-section, but as Picture 9 As shown, the coil wiring 21B of the third embodiment is composed of coil conductor layers 25a, 25b, and 25c having a T-shaped cross-section, and the cross-section of the coil wiring 21B has a T-shaped laminated shape.
[0127] At this time, the cross section of the coil wiring 21B is T-shaped, but the aspect ratio of the coil wiring 21B can be calculated from the cross-sectional area of the coil wiring 21B and the maximum thickness of the coil wiring 21B in the axial direction. Specifically, the aspect ratio is (the thickness T of the co...
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Abstract
Description
Claims
Application Information
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