Device for punching holes in FPC by using water-guided laser

Abstract

The invention relates to a device for punching holes in an FPC by using water-guided laser. The device comprises a conveying roller, a plurality of water-guided laser punching units, a control unit, adrying device and a detection device, wherein the conveying roller is used for conveying the FPC to be processed; the water-guided laser punching units are used for punching the FPC to be processed fixed on the conveying roller, are positioned above the FPC to be processed and are arranged on a first lifting platform; the control unit is used for sensing and judging the processing distance, is positioned above the FPC to be processed and is arranged on a second lifting platform; the drying device is used for drying the punched FPC; and the detection device is used for detecting the processedFPC. According to the device provided by the invention, the control unit is used for testing the laser intensity reaching the processing surface of the FPC to be processed after being coupled with water, the attenuation amount of laser energy in a water beam is obtained, and the proper coupling distance is judged according to the attenuation amount, so that the processing height during subsequentpunching is adjusted, and the feasibility of rapid processing is guaranteed.

Description

technical field [0001] The invention relates to the technical field of mechanical equipment, in particular to a device for drilling holes on an FPC with a water-conducting laser. Background technique [0002] FPC is a kind of FPC circuit board, which is called soft board or flexible circuit board or flexible circuit board. The unique characteristics of FPC make it an alternative to rigid circuit boards and traditional wiring solutions in many occasions, and it also promotes the development of many new fields. Due to the characteristics of small size and light weight, the market potential of flexible circuit technology in portable devices (such as mobile phones), flat panel displays and medical equipment is very large. [0003] Flexible circuit boards often use methods such as mechanical drilling, stamping, plasma etching, and laser drilling to form micro-vias. [0004] Mechanical drilling and stamping use high-precision drills and molds. These high-precision equipment are ...

AI Technical Summary

Problems solved by technology

[0007] However, the problem with excimer laser technology drilling is that the decomposition of polymers will produce carbon black attached to the hole wall, so some means must be taken to clean the surface to remove carbon black before electroplating; The biggest difficulty of excimer laser is that the drilling speed is slow and the processing cost is too high, so the processing range is limited

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