Heat conduction and heat dissipation integrated flat heat pipe

Abstract

The invention provides a heat conduction and heat dissipation integrated flat heat pipe. A condenser is designed in the cavity position of a traditional flat heat pipe to replace a condensation surface, steam generated at an evaporation end can be directly condensed on the surface of the condenser, heat released by condensation is directly taken away by a cooling working medium inside the condenser, and integration of heat conduction and heat sink heat dissipation of the flat heat pipe is achieved. Compared with the traditional flat heat pipe, the heat conduction and heat dissipation integrated flat heat pipe has the following advantages that 1) the steam generated at the evaporation end does not need to penetrate through a liquid layer and is directly condensed on the surface of the condenser, and gas-liquid separation in the true sense is achieved; 2) the heat released in the condensation process is directly taken away by the cooling working medium flowing inside the condenser, and contact heat resistance between the flat heat pipe and a heat sink is avoided; and 3) the condenser is arranged in the cavity position of the traditional flat heat pipe, the steam is condensed, and meanwhile, the supporting effect on the interior of the flat heat pipe is achieved, so that the structure is more compact, and the total volume of heat conduction and heat dissipation of the flat heat pipe is reduced.

Description

technical field [0001] The invention belongs to the technical field of heat transfer, and in particular relates to a flat heat pipe integrating heat conduction and heat dissipation, which can be applied to the cooling of servers, computer motherboards, aerospace heating elements and other devices. Background technique [0002] In recent years, with the continuous progress and development of electronic technology, the high frequency and high speed of electronic components, as well as the density and miniaturization of integrated circuits, make the calorific value of electronic devices per unit volume increase rapidly. The degree of integration of electronic circuits and the increase in power consumption of various high-power electronic devices, coupled with the smaller and smaller size of electronic devices or devices, make the requirements for heat dissipation of devices higher and higher. If the heat generated by the components cannot be dissipated in time and effectively, ...

AI Technical Summary

Problems solved by technology

However, the condensation heat of the flat heat pipe is transferred to the outside of the heat pipe through the heat conduction of the heat pipe wall, and this part of the heat is dissipated through the external heat sink, and there is a contact thermal resi

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