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Gas flow control method and device

A gas flow and control method technology, applied in the direction of valve devices, valve operation/release devices, electrical components, etc., can solve the problems of large fluctuations in oxygen concentration, waste of nitrogen, uneven product quality, etc., and achieve high control accuracy , accurate control, and the effect of saving nitrogen

Pending Publication Date: 2020-02-14
成都昶艾电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on the current technical situation, the control accuracy of oxygen concentration in wave soldering and reflow soldering furnaces is very low, and the oxygen concentration in the furnace fluctuates greatly, resulting in uneven product quality
Moreover, because the fixed flow rate in the prior art is not controlled in real time according to the actual needs in the furnace, the waste of nitrogen is still very serious

Method used

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  • Gas flow control method and device
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  • Gas flow control method and device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0071] This embodiment discloses a gas flow control method for adjusting the gas flow, including:

[0072] S001: Set several gas transmission channels with different diameters between the gas supply side and the gas consumption side, and each gas transmission channel is opened and closed by a separate control valve;

[0073] S002: Calculate the cross-sectional area to be opened of the gas transmission channel according to the opening signal;

[0074] S003: Open an appropriate number of control valves so that the sum of the gas supply cross-sectional areas of the corresponding opened gas transmission channels is equal to the required opening cross-sectional area of ​​the gas transmission channels; If the sum of the areas is equal, one more gas transmission channel is opened for intermittent gas supply.

[0075] In the method disclosed above, standard gas supply is performed by opening a number of gas transmission channels. Accurate flow control is met throughout the air suppl...

Embodiment 2

[0087] Such as Figure 1 to Figure 13As shown, the above embodiment has described the flow control method in detail, and this embodiment provides a flow control device, which will be described in detail here, specifically as follows:

[0088] A gas flow control device, comprising a gas outlet device 2, the gas outlet device 2 is provided with a second cavity 207, the second cavity 207 communicates with the gas supply side device and the gas use side device, and the second cavity 207 is connected to the gas side device A flow control structure is arranged between the air supply side device and / or the air use side device, and the flow control structure includes a number of exhaust holes communicating with the second cavity 207, and each of the exhaust holes is controlled by a separate The control valve controls on-off. In this embodiment, the control valve 225 is a solenoid valve.

[0089] The flow control device disclosed above controls the gas flow of the gas supply side dev...

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PUM

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Abstract

The invention relates to the field of gas supply control of a surface mounted technology, in particular to a gas flow control method and device. In the method, a plurality of gas conveying channels are opened for standard gas supply, when the gas flow cannot be regulated to perform stand gas supply on the integer gas conveying pipelines, an additional gas conveying pipeline can be adopted for intermittent gas supply, thus, the accurate flow control is met in the whole gas supply process. According to the flow control device, the gas circulation of a gas supply side device and the gas circulation of a gas using side device are controlled through a gas outlet device, the gas flow control method achieves the control over the gas flow, the flow control precision is improved, real-time controlover the nitrogen flow introducing into wave soldering and reflow soldering furnaces is achieved, supply and demand synchronization is achieved, and waste of nitrogen is reduced.

Description

technical field [0001] The invention relates to the field of gas supply control of surface mount technology, in particular to a gas flow control method and a device thereof. Background technique [0002] In the SMT (Surface Mounted Technology, surface mount technology) industry, wave soldering and reflow soldering furnaces need to feed a large amount of nitrogen during the production process to exhaust the oxygen in the furnace, avoiding the oxidation of metals on the surface of electronic devices at high temperatures, and reducing the number of terminals Product scrapping and rework. In order to reduce the nitrogen consumption in the production process and reduce the gas cost, it is necessary to control the nitrogen flow into the wave soldering and reflow furnace in real time to realize the synchronization of supply and demand and reduce the waste of nitrogen. [0003] In the prior art, the nitrogen flow control method in the wave soldering and reflow soldering furnace is:...

Claims

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Application Information

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IPC IPC(8): F16K11/22F16K31/06F16K27/00H05K3/34H05K13/04
CPCF16K11/22F16K27/00F16K31/0603H05K3/341H05K13/0465
Inventor 蒲友强
Owner 成都昶艾电子科技有限公司