Heat transfer performance testing device and testing method thereof for high-temperature heat pipe

A high-temperature heat pipe and heat transfer performance technology, applied in the field of heat transfer, can solve problems such as error, mass flow error of cooling medium, and large total error, and achieve the effects of high precision, simple equipment, and convenient testing

Active Publication Date: 2020-02-28
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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  • Abstract
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Problems solved by technology

[0018] Because the mass flow rate of the cooling medium often has a relatively large error during the test, there is a certain fluctuation in the inlet ...

Method used

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  • Heat transfer performance testing device and testing method thereof for high-temperature heat pipe
  • Heat transfer performance testing device and testing method thereof for high-temperature heat pipe

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Embodiment Construction

[0049] Such as figure 1 As shown, the present invention provides a novel high-temperature heat pipe heat transfer performance testing device, a high-temperature heat pipe heat transfer performance testing device, including a high-temperature heating device 1, a high-temperature heat pipe 2 to be tested, an insulating material 3, an air gap protective cover 4, Working medium container 5, working medium 6, working medium absorbing device 7, mass measuring system 8, electronic calculator 9, temperature measuring system 10, the condensing section of the high temperature heat pipe 2 to be tested is located in the air gap protective cover 4, to be tested The evaporating section of the high-temperature heat pipe 2 is heated by the high-temperature heating device 1. After the heat is transferred from the high-temperature heating device 1 to the evaporating section of the high-temperature heat pipe 2 to be tested, it is transferred from the evaporating section of the heat pipe to the ad...

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Abstract

The invention relates to a heat transfer performance testing device and a testing method thereof for a high-temperature heat pipe, and belongs to the technical field of heat transfer. The device comprises high-temperature heating equipment (1), a to-be-tested high-temperature heat pipe (2), a thermal insulation material (3), an air gap protection sleeve (4), a working medium container (5), a working medium (6), a working medium absorption device (7), a quality measurement system (8), an electronic computer (9), and a temperature measurement system (10). The heat transfer capacity is calculatedthrough the real-time change condition of the mass of the working medium absorption device, and the temperature of each temperature measurement point of the to-be-tested high-temperature heat pipe ismeasured in real time through the temperature measurement system, so the heat transfer performance of the high-temperature heat pipe can be calculated by combining the test data with the size parameters of the high-temperature heat pipe. The heat transfer amount is calculated without subtracting heat leakage from input heat, the heat transfer amount is calculated without measuring the mass flow and temperature change of the cooling medium, and the device is simple, convenient to test, high in test precision and the like.

Description

technical field [0001] The invention relates to a high-temperature heat pipe heat transfer performance testing device and a testing method thereof, belonging to the technical field of heat transfer. Background technique [0002] A heat pipe is a device that uses the principle of phase change to transfer heat efficiently. Among them, high-temperature heat pipes are one of the hot research directions in the field of heat pipes because of their high working temperature and good heat transfer performance. They have broad application prospects in thermal protection of hypersonic aircraft, cooling of space nuclear reactors, and utilization of solar energy. [0003] The performance of heat conduction is usually characterized by thermal conductivity (also known as thermal conductivity). Thermal conductivity means that under stable heat transfer conditions, the temperature difference between the two sides of a material (or device) with a thickness of 1m is 1K (or 1°C), the heat tran...

Claims

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Application Information

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IPC IPC(8): G01N5/02G01N25/18
CPCG01N5/02G01N25/18
Inventor 李金旺徐博文戴书刚
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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