Optical devices, optical ic chips, wafers and optical transceiver modules
A technology of optical devices and chips, applied in electromagnetic transceivers, optical components, optical waveguides and light guides, etc., can solve the problems of optical devices taking a long time
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no. 1 approach
[0027] Figure 5 An example of the optical IC chip according to the first embodiment is shown. In this embodiment, if Figure 5 As shown, the optical IC chip 100 includes a device region, a GC region and a foldback region. In the device region, an optical device circuit is formed. In this embodiment, the optical device circuit includes an optical receiver 10 and an optical modulator 20 . In the GC region, one or more grating couplers are formed. In this embodiment, the grating coupler 31 to the grating coupler 33 are formed in the GC region. In the folded-back region, some parts of the optical waveguide that couple the optical device circuit with the grating coupler 31 to the grating coupler 33 are formed.
[0028] In the embodiments described below, the optical device circuit formed on the optical IC chip includes the optical receiver 10 and the optical modulator 20, but the embodiment is not limited to this configuration. In other words, such a configuration that the o...
no. 2 approach
[0047] according to Figure 5 In the configuration shown in , in each optical IC chip, in addition to a device region for forming an optical device circuit, a GC region for forming a grating coupler and a foldback region for forming an optical waveguide are required. In this case, a smaller number of photo IC chips can be formed on one wafer. The second embodiment solves or alleviates this problem.
[0048] Figure 8 An example of the optical IC chip according to the second embodiment is shown. In this embodiment, the optical IC chip 100 has a rectangular shape. The shape of the optical IC chip 100 may be a parallelogram. Note that each grating coupler is in Figure 8 Indicated by "G".
[0049] exist Figure 8 , four optical IC chips 100a to 100d among a plurality of optical IC chips 100 formed on a wafer are shown, and these four optical IC chips are arranged adjacent to each other in the region of the upper left corner of the wafer. Note that the folded-back regions ...
no. 3 approach
[0058] exist Figure 8In the configuration shown in , a grating coupler for testing an optical device in an optical IC chip is formed in another optical IC chip. In the third embodiment, a grating coupler for testing optical devices in an optical IC chip is formed in the same chip.
[0059] Figure 9 An example of the optical IC chip according to the third embodiment is shown. In the third embodiment, the optical IC chip 100 may also have a rectangular shape or may be a parallelogram.
[0060] exist Figure 9 In , two optical IC chips 100 a and 100 b among a large number of optical IC chips 100 formed on a wafer are shown. The optical IC chip 100a is arranged on the uppermost side of the optical IC chip on the wafer. The optical IC chip 100b is arranged adjacent to the lower side of the optical IC chip 100a. Note that the turn-back region is formed adjacent to the upper side of the optical IC chip 100 arranged at the uppermost side of the optical IC chip on the wafer.
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