Electronic packaging structure and its manufacturing method

Abstract

An electronic packaging structure and its manufacturing method. An electronic component is arranged on a carrier with a circuit layer, and the electronic component is covered with a cladding layer, and a stepped opening exposing the circuit layer is formed on the cladding layer. The holes are used to snap the conductive elements into the stepped holes.

Description

technical field [0001] The present invention relates to a semiconductor structure, in particular to an electronic packaging structure and its manufacturing method. Background technique [0002] With the vigorous development of portable electronic products in recent years, the development of various related products is also moving towards the trend of high density, high performance, light, thin, short and small, and various types of semiconductor packaging structures are also cooperating with each other. It can meet the requirements of thinness, shortness and high density. [0003] figure 1 It is a schematic cross-sectional view of the known semiconductor package structure 1 . Such as figure 1 As shown, the semiconductor package structure 1 is provided with semiconductor elements 11 and passive elements 11' on the upper and lower sides of a substrate 10, and then encapsulates these semiconductor elements 11 and passive elements 11' with encapsulant 14, and makes the substr...

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Problems solved by technology

[0004] However, it is known that in the semiconductor package structure 1, since the opening 140 of the encapsulant 14 penetrates the encapsulant 14 by laser ablation, the glue shavings in the opening 140 cannot be effectively removed, causing the solder ball 13 to bond with the residual glue. shavings, causing the solder ball 13 to be unable to effectively contact and combine with the contact 100, or the solder ball 13 to be deformed by the extrusion of the rubber shavings, thus prone to ball drop (the solder ball 13 is separated from the contact 100), which in turn causes The overall ball planting yield is too low

[0005] In addition, laser ablation needs to be repeatedly fired at the same location with the same intensity of laser to form the opening 140 with the desired depth. However, due to thermal effects, the width of the opening 140 is difficult to control, so it is easy to become wide at the top and narrow at the bottom. Shaped or tapered opening 140, so the solder ball 13 cannot be effectively clamped in the opening 140, resulting in ball drop (the solder ball 13 is separated from the contact 100), which in turn causes the overall ball planting yield drop the ball too low

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