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High Temperature Epoxy Adhesive Formulations

An adhesive, epoxy novolac technology, applied in the direction of in-line novolac epoxy resin adhesives, adhesive types, adhesives, etc.

Active Publication Date: 2022-04-15
DDP SPECIALTY ELECTRONICS MATERIALS US LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Today's structurally toughened epoxy-based body shop adhesives are not fully capable of resisting thermal stress caused by different coefficients of linear thermal expansion (CLTE) of components made of different materials

Method used

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  • High Temperature Epoxy Adhesive Formulations
  • High Temperature Epoxy Adhesive Formulations
  • High Temperature Epoxy Adhesive Formulations

Examples

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example

[0026] The invention is further illustrated by the following non-limiting examples.

[0027] Table 1: List of Raw Materials for Adhesive Components

[0028]

[0029] * DER 330 54.8 parts by weight and Jeffamin D-2000 45.2 parts by weight were added to a laboratory reactor and heated to 100°C. The mixture was mixed under vacuum at 100°C for 60 minutes. Then cool the mixture to 60°C and tap it.

[0030] Table 2: List of raw materials for toughener A component

[0031]

[0032] General toughening agent A (preferred toughening agent) synthesis:

[0033] 1. First reaction step: Add x wt% of components [a] and [b] to a laboratory reactor and heat to 120°C. The mixture was mixed under vacuum at 120°C for 30 minutes. The mixture was then cooled to 60°C. If the temperature reaches 60°C, add x wt% of component [c] and mix it for 2 minutes. Then x wt% of component [d] was added, and the mixture was reacted at 85°C (bath temperature) for 45 minutes under nitrogen.

[0034] 2...

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Abstract

The present invention is an epoxy resin system useful as an adhesive for high temperature applications. The system is diglycidyl ether bisphenol epoxy resin in an amount of 30-70% by weight, with 1-10% by weight of epoxy novolak resin, 10-30% by weight of polyurethane toughening agent (which preferably has a blocked terminal isocyanate functional groups), 1-8% by weight of hardener, 0.1-% by weight of curing accelerator (preferably latent urea curing accelerator), provides the desired balance of mechanical strength and elastic modulus. The epoxy novolak resin is characterized by at least one of the following features: (i) having a viscosity of less than 3000 mPa·s at 25°C according to ASTM D-445, (ii) an epoxy resin of more than 2 but less than 3.7 The average number of groups per molecule, and (iii) a molecular weight of less than 750 g / mol.

Description

technical field [0001] The present invention relates generally to epoxy formulations useful for bonding various surfaces expected to be subjected to thermal stress, including particularly for bonding components in transportation vehicles. Background technique [0002] In the manufacture of transportation vehicles, including especially cars and trucks, different materials are used in the design to reduce the weight of the vehicle body. In addition to steel, lightweight materials such as aluminum or carbon fiber-reinforced composites are used. Also, adhesives are more commonly used than just soldered parts. Since the car body is heated during manufacture (e.g. in an electrocoat (e-coat) oven for corrosion protection where temperatures may range from 160 to 210C) and may also be subjected to a large temperature range in service Variations, and thus different rates of thermal expansion of different materials can cause significant mechanical stress at the junction between the m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/04C08G59/40C08G59/68
CPCC08G59/4021C08G59/686C09J163/04C08L63/00C08L75/04C09J163/00C08L63/04C09J11/00C09J2203/354C09J2301/30C08G18/12C08G18/3215C08G18/4854C08G18/69C08G18/73C08G59/245C08G2170/00C08L9/02C08L75/08C08L79/02C08L2205/025C08L2205/035
Inventor A·卢茨D·施耐德B·A·哈格I·梅德M·阿希旺登
Owner DDP SPECIALTY ELECTRONICS MATERIALS US LLC