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Power supply module packaging structure and power supply module packaging method

A power module and packaging structure technology, which is applied in the direction of circuits, electrical components, and electric solid devices, can solve the problems of poor heat dissipation performance and large packaging structure size, and achieve the effect of improving heat dissipation performance and reducing size

Inactive Publication Date: 2020-03-27
QINGDAO GOERTEK INTELLIGENT SENSOR CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The main purpose of the present invention is to provide a power module packaging structure and a power module packaging method, aiming to improve the current power module packaging structure size and poor heat dissipation problems

Method used

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  • Power supply module packaging structure and power supply module packaging method
  • Power supply module packaging structure and power supply module packaging method
  • Power supply module packaging structure and power supply module packaging method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] The package structure of the power module in this embodiment includes a substrate 100, a DC-DC chip 200, a capacitor, a MOS tube 320, a PIN pin 600, an inductor 400, and a plastic sealing part 500. The DC chip 200, the capacitor and the MOS tube 320 are installed on the top surface 110 of the substrate 100, the PIN needle 600 and the inductor 400 are installed on the bottom surface 120 of the substrate 100, and the plastic sealing part 500 includes the first plastic sealing layer 510 and the filling The second plastic packaging layer 520 is sealed on the bottom surface 120 , the DC-DC chip 200 , the capacitor, and the MOS tube 320 are packaged in the first plastic packaging layer 510 , and the PIN needle 600 and the inductor 400 are packaged in the second plastic packaging layer 520 . The second plastic sealing layer 520 is a compression molding layer, the thickness of the inductor 400 is equal to the thickness of the second plastic sealing layer 520, one end of the PIN ...

Embodiment 2

[0071] The package structure of the power module in this embodiment includes a substrate 100, an AC-DC chip 200, a capacitor, a PIN pin 600, an inductor 400, and a plastic sealing part 500. The capacitor is installed on the top surface 110 of the substrate 100, the PIN pin 600 and the inductor 400 are installed on the bottom surface 120 of the substrate 100, and the plastic sealing part 500 includes a first plastic sealing layer 510 potted on the top surface 110 and a second plastic sealing layer potted on the bottom surface 120. The layer 520 , the AC-DC chip 200 and the capacitor are packaged in the first plastic packaging layer 510 , and the PIN pin 600 and the inductor 400 are packaged in the second plastic packaging layer 520 . The second plastic sealing layer 520 is a compression molding layer, the thickness of the inductor 400 is equal to the thickness of the second plastic sealing layer 520, one end of the PIN pin 600 is connected to the substrate 100, and the other end...

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Abstract

The invention discloses a power supply module packaging structure and a power supply module packaging method. The power supply module packaging structure comprises a substrate, a chip, a first electronic component, a second electronic component and a plastic packaging part, wherein the substrate comprises a top surface and a bottom surface which are oppositely arranged; the chip and the first electronic component are installed on the top surface of the substrate; the first electronic component is installed on the top surface of the substrate; the second electronic component is installed on thebottom surface of the substrate; the plastic packaging part comprises a first plastic package layer encapsulated on the top surface and a second plastic package layer encapsulated on the bottom surface; and the chip and the first electronic component are encapsulated in the first plastic package layer, and the second electronic component is encapsulated in the second plastic package layer. According to the power supply module packaging structure, the size of the power supply module packaging structure is reduced; and the chip and the first electronic component can dissipate heat through the top surface of the substrate, and the second electronic component can dissipate heat through the bottom surface of the substrate, thereby improving the heat dissipation performance of the power modulepackaging structure.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a power module packaging structure and a power module packaging method. Background technique [0002] The power module is a power supply that can be directly mounted on the printed circuit board, and its characteristic is that it can provide power for application-specific integrated circuits, digital signal processors, microprocessors, memories, field programmable gate arrays and other digital or analog loads . Power modules are indispensable for electronic systems. In today's society, people's lives cannot be separated from electronic devices for a moment. [0003] The power management chip is a chip responsible for the conversion, distribution, detection and other power management responsibilities of electric energy in the electronic equipment system. The application range of the power management chip is very wide. In order to increase the density of electronic systems,...

Claims

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Application Information

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IPC IPC(8): H01L23/495H01L21/56
CPCH01L23/49568H01L23/49541H01L23/49575H01L21/56H01L2224/49175H01L2224/49171H01L2224/49111H01L2224/0603H01L2224/48091H01L2924/181H01L2224/49431H01L2924/00014H01L2924/00012
Inventor 王德信张利丹陶源
Owner QINGDAO GOERTEK INTELLIGENT SENSOR CO LTD
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