A solder ball welding device with a coaxial vision system

Abstract

The invention designs a solder ball welding device with a coaxial vision system, including a laser focusing head, a rotating motor, a controller, a CCD camera, an imaging lens, and a rotating disk. The device overlaps part of the laser light path and the visual imaging light path to realize laser welding It is coaxial and co-focused with the vision. At the same time, the welding nozzles and imaging windows of different specifications can be switched through the rotation of the rotating disk to realize the fast switching of different sizes of solder ball welding and visual imaging. The spot size can be quickly adjusted to adapt to nozzles with different apertures, satisfying Solder joint requirements of different sizes. When using this device for welding, any number of solder balls can be replenished in real time, and after the solder balls enter the transition chamber, they will directly melt and drop on the pad during the falling process, without staying at the nozzle mouth, which shortens the soldering time and improves production. efficiency.

Description

technical field [0001] The invention relates to a solder ball welding device with a coaxial vision system, in particular to a laser welding device using solder balls as solder. The field of ball welding technology. Background technique [0002] Laser solder ball welding is mainly used in small and fine processing occasions such as hard disk heads, camera modules, and VCM enamelled coil modules. Traditional solder ball welding has the advantages of no spatter residue, no laser burns, and good tin quantity consistency. The existing content such as the Chinese utility model patent "Automatic Solder Ball Soldering Machine" (201821024456.1) or the invention patent "A Solder Ball Welding Structure and Method for Precise and Fine Welding Areas" (201710985532.9) is that the laser does not directly When the solder ball is irradiated on the pad, the solder ball is melted and then transported to the product to be soldered by the solder ball supply mechanism, and the product to be sold...

AI Technical Summary

Problems solved by technology

Its shortcoming is that this method only uses laser melting pre-arranged solder balls to complete the soldering, and cannot continuously replenish solder balls during the soldering process, that is, the soldering process is decomposed into two stages: ball placement and soldering, and the patent cannot be based on Nozzles with different apertures are selected for the size of the pad, and there is no coaxial vision, so the position of the processing point cannot be recognized coaxially with high precision

Its shortcomings are: the first patent is mainly used for single solder ball welding, the second patent controls the start and stop of the laser through the change of inner cavity air pressure, and the above two patents cannot continuously replenish solder balls under continuous laser irradiation

However, limited by the installation environment and space of the equipment, the existing vision system can only be installed on the oblique position that is not in the same axis as the laser output light, and cannot obtain the real image of the solder joint in all directions, which is not conducive to the solder joint If the omnidirectional shooting method around the optical axis is adopted, the difficulty of setting and arrangement will be greatly increased, and the evaluation time will increase, which is not conducive to improving production efficiency

[0006] To sum up, none of the existing laser solder ball welding devices discloses a visual system that is coaxial with the light output of the laser to achieve accurate and fast solder spot evaluation.

Images