Preparation method of flexible photoelectric device

Abstract

The invention relates to a preparation method of a flexible photoelectric device. The preparation method comprises the following steps: S1, processing a substrate; S2, completing the preparation of adevice preparation unit region, including preparing a plurality of high-roughness areas and a plurality of low-roughness areas surrounding the high-roughness areas on a glass carrier plate; each high-roughness region and the low-roughness region surrounding the high-roughness region forming a device preparation unit region; S3, directly arranging flexible polymer substrates on the device preparation unit area, pasting transparent conductive electrodes on the flexible substrates, and each flexible polymer substrate being provided with cholesteric liquid crystals capable of reflecting red or green or blue; S4, preparing an orientation layer; and S5, manufacturing a flexible photoelectric device finished product of which the structure is divided into an upper flexible substrate layer, an upper orientation layer, a liquid crystal layer, a lower orientation layer and a lower flexible substrate layer from top to bottom. According to the invention, high-efficiency large-scale production can be realized, and the product quality is guaranteed.

Description

technical field [0001] The invention relates to the field of flexible electronic devices, in particular to a method for preparing a flexible photoelectric device. Background technique [0002] The flexible optoelectronic devices in the prior art have used photolithography technology for many times, and there is still the problem of high process cost, and in the process of peeling off the device from the rigid substrate, problems such as colloidal contamination are prone to occur; The flatness of the surface of the flexible substrate will be destroyed in a vacuum state, which will affect the subsequent device preparation process and device performance. Contents of the invention [0003] The purpose of the present invention is to overcome the defects existing in the prior art, and provide a method for preparing a flexible photoelectric device that realizes high-efficiency large-scale production and guarantees product quality. [0004] The technical solution for realizing th...

AI Technical Summary

Problems solved by technology

[0002] The flexible optoelectronic devices in the prior art have used photolithography technology for many times, and there is still the problem of high process cost, and in the process of peeling off the device from the rigid substrate, problems such as colloidal contamination are prone to occur; In the vacuum state, the flatness of the flexible substrate surface will be destroyed, which will affect the subsequent device preparation process and device performance.