Forming processing method of printed circuit board with semi-copper holes
A printed circuit board, forming processing technology, applied in the direction of printed circuit, printed circuit manufacturing, electrical components, etc., can solve the problems of reducing processing efficiency, increasing processing cost, increasing manual maintenance, etc., to achieve excellent surface quality and save processing cost Effect
Active Publication Date: 2020-04-07
厦门鸿鹭联创工具有限公司
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Problems solved by technology
Due to the incompleteness of the printed circuit board, there are hollow holes and grooves, resulting in certain unreliability of the post-process text and solder resist ink
[0003] Due to the good ductility of copper, when processed according to the conventional method, the glass fiber and copper wire lack a force point at the half-copper hole, and it is easy to form wire drawing due to avoidance; and the wire drawing at the half-hole will cause electroplating plugs in the subsequent process hole etc.
The existing processing methods are basically unable to avoid the wire drawing problem, and the wire drawing can only be removed by increasing manual inspection and cleaning, which reduces the processing efficiency and increases the processing cost
Method used
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[0029] To further illustrate the various embodiments, the present invention is provided with accompanying drawings. These drawings are a part of the disclosure of the present invention, which are mainly used to illustrate the embodiments, and can be combined with related descriptions in the specification to explain the operating principles of the embodiments. With reference to these contents, those skilled in the art should understand other possible implementations and advantages of the present invention. Components in the figures are not drawn to scale, and similar component symbols are generally used to denote similar components.
[0030] The present invention will be further described in conjunction with the accompanying drawings and specific embodiments.
[0031] A method for forming and processing a printed circuit board with a half-copper hole provided in this embodiment, the method includes the following steps:
[0032] The method includes the following steps:
[003...
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The invention provides a forming processing method of a printed circuit board with a semi-copper hole, and relates to the technical field of printed circuit board processing. The method comprises thefollowing specific steps: S1, roughly milling an inner groove; S2, cutting by a front-edge milling cutter; S3, lifting the front-edge milling cutter; S4, feeding the front-edge milling cutter; S5, repeating the steps S2-S4 until forward cutting of all hole walls is completed; S6, cutting by a reverse-edge milling cutter; S7, lifting the reverse-edge milling cutter; S8, feeding the reverse-blade milling cutter; and S9, repeating the steps S6-S8 until reverse cutting of all hole walls is completed. Compared with a conventional semi-copper hole machining method, the method has the advantages thatfour procedures of tin plating, one-time forming, acid pickling and alkali washing can be omitted, and the machining cost is greatly reduced; and compared with a conventional burr removing process, the method has the advantages that the surface quality is better through one-time machining, and the machining reliability of processes such as characters and solder mask ink in the manufacturing process of the printed circuit board is improved.
Description
technical field [0001] The invention relates to the technical field of printed circuit board processing, in particular to a method for forming and processing a printed circuit board with half-copper holes. Background technique [0002] The method of reserving half-copper holes is widely used in the design of printed circuit boards, and this design will bring great processing difficulty to the subsequent molding process. At present, the conventional half-copper hole processing method is as follows: firstly, the tin plating process, and then directly confirm the diameter of the milling cutter according to the size of the half-hole slot distance, and form it with one knife, and then remove the copper drawing by pickling, and finally remove the copper by alkali washing Surface protection tin. Due to the incompleteness of the printed circuit board, there are hollow holes and grooves, resulting in certain unreliability of the post-process text and solder resist ink. [0003] Due...
Claims
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IPC IPC(8): H05K3/00
CPCH05K3/0044
Inventor 柯建泉魏志杰王长泰李生乐高武艺
Owner 厦门鸿鹭联创工具有限公司