Preparation method of novel AB adhesive film

A new type of adhesive film and technology, applied in the direction of adhesives, adhesive types, films/sheets without carriers, etc., can solve problems such as the inability to convey the photosensitive effect of screen fingerprints, the inability to perfectly fit curved screens, and the failure of screen fingerprint unlocking, etc. , to achieve the effect of good appearance, sensitive unlocking effect and good compliance

Pending Publication Date: 2020-04-10
宁波启合新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 1) The transparency is not high, which affects the visibility, whether it is an electronic product or a car, it affects the use;
[0006] 2) The rework performance is poor, and once the acrylic surface is wrongly bonded to the tempered glass, it is basically impossible to rework;
[0007] 3) Unable to perfectly fit the curved screen, due to the existence of the base material, the AB glue product is too stiff, and the followability is poor, so it cannot fit the curved screen;
[0008] 4) The light-sensing effect of the screen fingerprint cannot be conveyed, resulting in the failure of the screen fingerprint unlocking

Method used

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  • Preparation method of novel AB adhesive film
  • Preparation method of novel AB adhesive film
  • Preparation method of novel AB adhesive film

Examples

Experimental program
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preparation example Construction

[0032] The preparation method comprises the following steps:

[0033] Step 1. Preparation of the first adhesive layer: After fully stirring the acrylic adhesive solution used for preparing the first adhesive layer 2, filter it with a filter screen of 10-40 μm, and use dimples, comma shafts or slits on the coating machine Coated on the first release layer 1 by extrusion, after drying in a four-section oven, it was bonded and rolled with the engineering film (organic silicon release film) to obtain the first adhesive layer 2, and the first adhesive Layer 2 is pasted on the lower side of the first release layer 1;

[0034] Step 2. Preparation of the second adhesive layer: After fully stirring the prepared second adhesive layer 3 silicone adhesive solution evenly, filter it with a filter screen of 10-40 μm for use. Peel off the above-mentioned engineering film (organic silicon release film), on the prepared first adhesive layer 2, use the comma shaft or slit extrusion on the coat...

Embodiment 1

[0041] 1) Preparation of the first adhesive layer 2:

[0042] Coat the prepared acrylic adhesive with dimples on the surface of the 50 μm fluorine release film, that is, the first release layer 1. The thickness of the coating is 20 μm. Drying in a special oven, starting at a speed of 5m / min, after drying is complete, it will be bonded and rolled with the engineering film (organic silicon release film);

[0043] 2) Preparation of the second adhesive layer 3:

[0044] Peel off the above-mentioned engineering film (organic silicon release film), and apply the prepared silicone adhesive on the surface of the first adhesive layer 2 with dimples. The thickness of the coating is 20 μm. Dry in a four-section oven at 140°C with a starting speed of 5m / min. After drying is complete, it is bonded and wound with a 50μm fluorine release film, that is, the second release layer 4 .

[0045] Place the above-prepared product in an oven at 40°C for 2 days to mature to obtain the final stable p...

Embodiment 2

[0047] 1) Preparation of the first adhesive layer 2:

[0048] Coat the prepared acrylic adhesive with a comma shaft on the surface of the 75 μm fluorine release film, namely the first release layer 1, with a coating thickness of 20 μm. Drying in a special oven, the starting speed is 30m / min, after drying is complete, it is bonded with the engineering film (organic silicon release film) for winding;

[0049] 2) Preparation of the second adhesive layer 3:

[0050] Peel off the above-mentioned engineering film (organic silicon release film), and apply the prepared organic silicon adhesive on the surface of the first adhesive layer 2 with a comma axis. The thickness of the coating is 100 μm. Dry in a four-section oven at 140°C with a starting speed of 30m / min. After drying is complete, it will be bonded and rolled with a 50μm fluorine release film, that is, the second release layer 4 .

[0051] Put the above-prepared product in an oven at 40°C for 3 days for aging to obtain the ...

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Abstract

The invention discloses a preparation method of a novel AB adhesive film. The novel AB adhesive film comprises a first release layer, a first adhesive layer, a second adhesive layer and a second release layer, wherein the first adhesive layer and the second adhesive layer are arranged up and down and directly bonded together, the first release layer is bonded on the upper side of the first adhesive layer, and the second release layer is bonded on the lower side of the second adhesive layer. The preparation method comprises the steps: 1, preparation of the first release layer; 2, preparation ofthe second adhesive layer, and bonding of the first release layer, the first adhesive layer, the second adhesive layer, and the second release layer. The preparation method is ingenious in conception, reasonable in structural arrangement, softer in material, good in following performance, better in consistency and fitness of electronic product protection and better in sensitivity for fingerprintunlocking products.

Description

technical field [0001] The invention relates to the technical field of screen protective films, in particular to a preparation method of a novel AB adhesive film. Background technique [0002] In the prior art, the screen protection of electronic products is mainly realized by AB type double-sided adhesive tape, one side of which is a high-viscosity surface, which plays the role of fixing the bonding process / shipment protection screen and protective film, and the other side is a low-viscosity surface. The surface has a good adsorption effect and plays the role of protecting the screen of the electronic product itself. After attaching, the air bubbles are instantly exhausted to ensure the attaching effect on the surface of the product. As the screens of existing electronic products are developing towards screen fingerprint unlocking, the sensitivity requirements for protective layer materials are getting higher and higher. Traditional double-sided tapes with substrates can no...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/10C09J133/04C09J183/04
CPCC08L2205/025C09J7/10C09J133/04C09J183/04C09J2301/208C09J2433/00C09J2483/00C08L83/04
Inventor 李晶刘川
Owner 宁波启合新材料科技有限公司
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