Indium bump resetting method for infrared detector reading circuit

Abstract

The invention discloses an indium bump resetting method for an infrared detector reading circuit, and the method comprises the steps: enabling the reading circuit to be immersed in glycerol at a preset temperature T for standing, so as to remove a scrapped indium bump on the reading circuit; and resetting the specification indium bumps on the reading circuit from which the scrapped indium bumps are removed. According to the invention, resetting of the indium bumps of the readout circuit is realized, the indium bumps on the reading circuit can be removed by adopting a physical method, and thenthe indium bumps are grown again, so that waste products of the reading circuit due to the indium bump processing problem can be avoided, the 100% yield of indium bump processing of the reading circuit is realized, and the reading circuit with the good performance can be repeatedly used for many times.

Description

technical field

[0001] The invention relates to the technical field of semiconductor circuit processing in microelectronic technology, in particular to a method for resetting indium bumps of an infrared detector readout circuit. Background technique

[0002] Infrared focal plane detection technology has significant advantages such as wide spectral response band, more ground target information can be obtained, and can work day and night. It is widely used in early warning detection, intelligence reconnaissance, damage effect assessment, and investigation, development and Management, weather forecast, geothermal distribution, earthquake, volcanic activity, space astronomical exploration and other fields.

[0003] HgCdTe infrared detector is one of the representative products of infrared detection technology. With the advancement of technology, the area array scale of mercury cadmium telluride infrared detectors continues to develop. The mercury cadmium telluride infrared det...

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