Indium bump resetting method for infrared detector reading circuit

A technology of infrared detectors and readout circuits, applied in circuits, electrical components, semiconductor devices, etc., can solve problems such as waste

Active Publication Date: 2020-04-10
11TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] An embodiment of the present invention provides a method for resetting the indium bumps of the infrared detector readout circuit, which is used to solve the waste problem of the readout circuit in the prior art due to the processing of the indium bumps

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  • Indium bump resetting method for infrared detector reading circuit
  • Indium bump resetting method for infrared detector reading circuit
  • Indium bump resetting method for infrared detector reading circuit

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Embodiment Construction

[0033] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided for more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0034] The embodiment of the present invention proposes a method for resetting the indium bump of the infrared detector readout circuit, such as figure 1 As shown, the method includes:

[0035] S11, immersing the readout circuit in glycerin with a preset temperature T and standing still, so as to remove scrapped indium bumps on the readout circuit;

[0036] S12, resetting standard indium bumps on the readout circuit from which sc...

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Abstract

The invention discloses an indium bump resetting method for an infrared detector reading circuit, and the method comprises the steps: enabling the reading circuit to be immersed in glycerol at a preset temperature T for standing, so as to remove a scrapped indium bump on the reading circuit; and resetting the specification indium bumps on the reading circuit from which the scrapped indium bumps are removed. According to the invention, resetting of the indium bumps of the readout circuit is realized, the indium bumps on the reading circuit can be removed by adopting a physical method, and thenthe indium bumps are grown again, so that waste products of the reading circuit due to the indium bump processing problem can be avoided, the 100% yield of indium bump processing of the reading circuit is realized, and the reading circuit with the good performance can be repeatedly used for many times.

Description

technical field [0001] The invention relates to the technical field of semiconductor circuit processing in microelectronic technology, in particular to a method for resetting indium bumps of an infrared detector readout circuit. Background technique [0002] Infrared focal plane detection technology has significant advantages such as wide spectral response band, more ground target information can be obtained, and can work day and night. It is widely used in early warning detection, intelligence reconnaissance, damage effect assessment, and investigation, development and Management, weather forecast, geothermal distribution, earthquake, volcanic activity, space astronomical exploration and other fields. [0003] HgCdTe infrared detector is one of the representative products of infrared detection technology. With the advancement of technology, the area array scale of mercury cadmium telluride infrared detectors continues to develop. The mercury cadmium telluride infrared det...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/18H01L31/02
CPCH01L31/18H01L31/02016Y02P70/50
Inventor 张轶蔡晨刘世光孙浩
Owner 11TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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