Supercharge Your Innovation With Domain-Expert AI Agents!

Microwave signal vertical interconnection device and interconnection method

A microwave signal and vertical interconnection technology, applied in the microwave field, can solve problems such as low interconnection density

Active Publication Date: 2020-04-17
航天科工微系统技术有限公司
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above analysis, the embodiment of the present invention aims to provide a microwave signal vertical interconnection device and interconnection method to solve the existing interconnection problems existing in the microwave signal interconnection method applied between multilayer printed circuit boards. Problems such as low connection density

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Microwave signal vertical interconnection device and interconnection method
  • Microwave signal vertical interconnection device and interconnection method
  • Microwave signal vertical interconnection device and interconnection method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] This embodiment provides a microwave signal vertical interconnection device, such as Figure 1-3 , 5-8, including a first microwave signal board 1, a second microwave signal board 2, a conductive adhesive film and a microwave signal shielding board 3; both the first microwave signal board 1 and the second microwave signal board 2 are provided with microwave Signal transmission line 4; the first microwave signal plate 1 and the microwave signal shielding plate 3 are arranged alternately and contacted to form a microwave signal transmission assembly, the two outer sides of the microwave signal transmission assembly are microwave signal shielding plates 3; the microwave signal transmission assembly and the second microwave The signal board 2 is arranged vertically, the first microwave signal board 1 is connected to the second microwave signal board 2 through a conductive film, and the microwave signal is transmitted vertically to the interface of the second microwave signal...

Embodiment 2

[0071] The difference between the vertical interconnection device for microwave signals between multilayer printed circuit boards provided in this embodiment and that in Embodiment 1 is that the setting position of the microwave signal transmission line 4 on the first microwave signal board 1 is different, and other structures and uses The operations are the same and will not be repeated here.

[0072] Such as Figure 1-2 , 4-8, the microwave signal transmission line 4 of this embodiment is set inside the first microwave signal board 1 and forms the first stripline; the first stripline extends to the edge of the second microwave signal board 2 and leads out to the second Two signal contacts 6; ground contacts are provided on both sides of the second signal contact 6, and a second blank area is provided between the second metal ground contact 8 and the second signal contact 6; the second signal contact 6 , the second metal ground contact 8 and the second blank area form the se...

Embodiment 3

[0081] Such as Figure 6 to Figure 16 As shown, a structure of the second microwave signal board in this embodiment is:

[0082] The microwave signal transmission line is arranged inside the second microwave signal board and forms the second stripline 19, and the third signal contact is connected with the second stripline 19 through the metallized hole 17; The arrayed through shielding holes 16 and non-penetrating shielding holes 18 are connected to the rectangular grounding ring.

[0083] The second structure of the second microwave signal board in this embodiment is:

[0084] The microwave signal transmission line is arranged inside the second microwave signal board to form a second stripline 19, a metal shielding plate is arranged inside the second microwave signal board, and a coupling slot 20 is arranged on the metal shielding board, and the third signal contact passes through the coupling slot 20 transmits the electromagnetic energy onto the second stripline 19 .

[0...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a microwave signal vertical interconnection device and interconnection method, belongs to the technical field of microwave signal transmission, and solves the problems of lowinterconnection density and the like of an existing microwave signal interconnection mode applied between multiple layers of printed circuit boards. The device comprises first microwave signal plates,second microwave signal plates, a conductive adhesive film and a microwave signal shielding plate, microwave signal transmission lines are arranged on the first microwave signal plates and the secondmicrowave signal plates; the first microwave signal plates and the microwave signal shielding plates are alternately arranged and are in contact to form a microwave signal transmission assembly, themicrowave signal transmission assembly and the second microwave signal plates are vertically arranged, and microwave signals are vertically transmitted to the second microwave signal plates interfacesthrough the first microwave signal plates. According to the invention, vertical interconnection of high-density and low-profile microwave signals is realized under the condition that a microwave connector is not adopted, and the microwave connector has the advantages of good consistency, high reliability and high interconnection density.

Description

technical field [0001] The invention relates to the field of microwave technology, in particular to a microwave signal vertical interconnection device and an interconnection method. Background technique [0002] In phased array antenna-feed integrated components and systems, the transmission direction of the signal in the microwave transceiver channel is often perpendicular to the signal transmission direction in the antenna feed network, and they are respectively on two multilayer printed circuit boards. If the assembly relationship between two multilayer printed boards is vertical, to realize the transmission of microwave signals from one printed board to the other, microwave connectors are generally used at present. [0003] However, microwave connectors need to occupy a certain volume and cannot achieve higher interconnection density. If microwave connectors are not used, the vertical interconnection of microwave signals between multilayer printed boards cannot be reali...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K1/14H05K3/36
CPCH05K1/14H05K3/366
Inventor 狄隽王升旭王强济岳超许兰锋王志明夏若飞
Owner 航天科工微系统技术有限公司
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com