Unlock instant, AI-driven research and patent intelligence for your innovation.

Circuit board etching equipment

A technology for etching equipment and circuit boards, used in printed circuits, printed circuit manufacturing, electrical components, etc., can solve problems such as volatile gases, personnel and environmental damage, and achieve the effect of reducing pollution

Active Publication Date: 2020-04-17
悦虎晶芯电路(苏州)股份有限公司
View PDF3 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, because the existing etching equipment needs to put the circuit board from above, it is generally an open structure, which causes ammonia and other gases to easily volatilize into the air, which is harmful to personnel and environmental damage

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit board etching equipment
  • Circuit board etching equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments. Note that the aspects described below in conjunction with the drawings and specific embodiments are only exemplary, and should not be construed as limiting the protection scope of the present invention.

[0031] Such as figure 1 and figure 2 As shown, the embodiment of the present invention discloses a circuit board etching equipment, including an etching box 1, a circuit board lifting device 2 is arranged on the etching box, the circuit board lifting device 2 includes a sealing cover 2a, when the circuit board lifting device 2 is lowered , the sealing cover 2a completes the sealing of the etching box 1, one side of the etching box 2 is provided with a liquid medicine adding device 3, and the other side of the etching box 1 is provided with a drain pipe 4 and a waste gas collecting pipe 5, and the liquid medicine adding device 3 passes throug...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses circuit board etching equipment. The circuit board etching equipment comprises an etching box, a circuit board lifting device is arranged on the etching box, the circuit boardlifting device comprises a sealing cover, after the circuit board lifting device descends, the sealing cover seals the etching box, a liquid medicine adding device is arranged on one side face of theetching box, a liquid discharging pipe and a waste gas collecting pipe are arranged on the other side face of the etching box, and the liquid medicine adding device communicates with the etching box through a feeding assembly. By arranging the circuit board lifting device, after the circuit board lifting device descends, the sealing cover completes sealing of the etching box, so that it is ensuredthat harmful gas in the etching process cannot volatilize into air, and pollution to the environment is reduced.

Description

technical field [0001] The invention relates to circuit board processing technology, in particular to circuit board etching equipment. Background technique [0002] Etching is an important process in the production process of circuit boards. According to the nature of the chemicals used, it is divided into acid etching and alkaline etching. During alkaline etching, the following reactions are included: [0003] (1) Add ammoniacal liquor in cupric chloride solution, complexation reaction takes place: [0004] CuCl 2 +4NH 3 →Cu(NH 3 )4Cl 2， [0005] (2) During the etching process, the copper on the substrate is covered by [Cu(NH 3 ) 4 〕 2+ Complex ion oxidation, its etching reaction: [0006] Cu(NH 3 ) 4 Cl 2 +Cu→2Cu(NH 3 ) 2 Cl, [0007] (3) [Cu(NH 3 ) 2 〕 1+ It does not have etching ability. In the presence of excess ammonia and chloride ions, it can be quickly oxidized by oxygen in the air to form [Cu(NH 3 ) 4 〕 2+ Complex ion, its regeneration reactio...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/06C23F1/34C23F1/08
CPCH05K3/068C23F1/08C23F1/34
Inventor 陈斌卢耀普黄治国卢振华刘国强
Owner 悦虎晶芯电路(苏州)股份有限公司