Laser and preparation method thereof
A technology of lasers and light-emitting units, which is applied to lasers, laser components, semiconductor lasers, etc., and can solve the problems of complex assembly process, unfavorable pulse use, and large volume of VCSEL modules
Inactive Publication Date: 2020-04-21
VERTILITE CO LTD
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Problems solved by technology
[0003] In current laser applications, VCSELs are generally top-emitting. In order to meet the needs of different field of view (FOV), VCSELs usually need to be assembled with dodging sheets of different specifications after the process of mounting and bonding, which makes The assembly process of the VCSEL module becomes relatively complicated, and the corresponding volume is relatively large, which is not conducive to the reduction of module cost and the realization of miniaturization
On the other hand, the top-emitting wire bonding process will also bring lead inductance, which is an important factor restricting the overall time response, which is not conducive to the use of higher frequencies and shorter pulses
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[0047] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0048] see Figure 1 to Figure 3 As shown, the present invention provides a laser 40 , which includes: a substrate 100 , a laser chip 200 , a package 300 and a first optical structure 400 .
[0049] see Figure 1 to Figure 3 As shown, in this embodiment, the substrate 100 is a circuit board, which is used to control the laser chip 200 to emit light. In some other embodiments, the substrate 100 may also be a support plate only used for supporting. T...
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Abstract
The invention discloses a laser and a preparation method thereof, and belongs to the technical field of semiconductors. The laser comprises a laser chip comprising: a substrate; at least one light-emitting unit which on the substrate; non-light-emitting regions which are arranged on the two sides of the light-emitting unit; a first electrode layer which is formed on one side, deviating from the substrate, of the non-light-emitting regions; a second electrode layer which is formed on one side, deviating from the substrate, of the light-emitting unit; and a base plate which is provided with a third electrode layer and a fourth electrode layer, wherein the third electrode layer and the fourth electrode layer are respectively connected with the first electrode layer and the second electrode layer in an alignment manner. The positive electrode and the negative electrode of the laser are placed on the same side so that adverse effects caused by lead inductance generated by a routing processare avoided.
Description
technical field [0001] The invention belongs to the technical field of semiconductors, and in particular relates to a laser and a preparation method thereof. Background technique [0002] Vertical Cavity Surface Emitting Laser (VCSEL) is a new type of laser that emits light vertically on the surface. Its different structure from traditional edge emitting lasers brings many advantages. In addition, because the light emitting direction of VCSEL is vertical to the substrate, it can easily realize high density two The integration of three-dimensional area array can achieve higher power output, and because multiple lasers can be arranged in parallel in the direction perpendicular to the substrate, it is very suitable for applications in the fields of parallel optical transmission and parallel optical interconnection. It has an unprecedented The speed has been successfully applied to single-channel and parallel optical interconnections. With its high cost performance, it has been ...
Claims
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IPC IPC(8): H01S5/183H01S5/187H01S5/042
CPCH01S5/0425H01S5/18305H01S5/18341H01S5/187
Inventor 毛明明李齐柱周特张鹏飞徐真真
Owner VERTILITE CO LTD