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A process method of zero-taper through-hole for transparent brittle material

A technology of brittle materials and through-hole technology, which is applied in the direction of manufacturing tools, metal processing equipment, welding equipment, etc., to achieve the effect of improving thermal damage, reducing device cost, and improving processing pollution problems

Active Publication Date: 2022-04-12
WUHAN HGLASER ENG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to address the problems existing in the prior art, and to provide a zero-taper through-hole processing method for transparent brittle materials, so as to solve at least one of the problems in the prior art

Method used

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  • A process method of zero-taper through-hole for transparent brittle material
  • A process method of zero-taper through-hole for transparent brittle material
  • A process method of zero-taper through-hole for transparent brittle material

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Embodiment

[0047] This embodiment provides a process method for a zero-taper through hole of a transparent brittle material, which is realized by a processing device for a zero-taper through hole of a transparent brittle material. In this embodiment, a through hole with a diameter of 1.68 mm is processed on sapphire with a processing thickness of 0.3 mm by using the device and method described above.

[0048] Specific steps are as follows:

[0049] Step 1. Set the required processing image files through the laser control system. In order to achieve the technical effect described in the present invention, the processing image is composed of helical lines with the same inner radius of 1.68 mm and different outer radii interlaced with the center of the circle. The minimum outer radius of the different helixes is 1.925mm, and then the outer radius is increased to 2.125mm in steps of 0.015mm, and there are 13 sets of helixes in total. The pitches of the helixes with different outer radii ar...

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Abstract

The invention discloses a process method for through-holes with zero taper of transparent and brittle materials, comprising: setting spiral processing graphic files; setting laser parameters; adjusting the inclination angle of the laser beam, focusing the laser light on the surface of the sample to be processed; and processing the sample to be processed in sections . The present invention adopts the helical lines with the same inner radius and different outer radii to overlap with the center of the circle to form a processing path, which improves the processing efficiency. At the same time, different helical lines can be combined arbitrarily to provide optimization for non-taper processing; the combination of vibrating mirror and focusing mirror is adopted. Changing the incident angle of the laser beam reduces the cost of the device in the application process, and is suitable for various non-tapered processing. At the same time, the laser beam is at a certain angle with the surface of the sample to be processed to improve the thermal damage of the sample surface at the laser entrance; using segmented processing, Different stages match different laser processing parameters, making the processing process and requirements flexible and controllable.

Description

technical field [0001] The invention relates to the field of processing transparent and brittle materials, in particular to the application of ultrashort pulse laser ablation to transparent and brittle materials, in particular to a zero-taper through-hole process method for transparent and brittle materials. Background technique [0002] The application and development of transparent and brittle materials in industry and life has led to an increase in the processing requirements of transparent and brittle materials. The existing processing methods of transparent brittle materials include mechanical processing and laser processing. Among them, during mechanical processing, the material is prone to fragmentation, which is not universally applicable, and is not suitable for the processing of smaller holes; while ordinary laser processing usually requires water-assisted processing, or processing from bottom to top, in order to obtain straight holes. There are certain pollution ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/384B23K26/142B23K26/08B23K26/70
CPCB23K26/384B23K26/142B23K26/702B23K26/08
Inventor 王玉莹王雪辉程伟
Owner WUHAN HGLASER ENG CO LTD
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