Low speed die-stamping pin assembly for punching LTCC raw porcelain slice for electronic product and processing technology thereof

Abstract

The invention discloses a low speed die-stamping pin assembly for punching an LTCC raw porcelain slice for an electronic product. The low speed die-stamping pin assembly comprises a low speed die-stamping pin and a low speed die lower die, wherein the low speed die-stamping pin comprises a stamping pin body and a pin head arranged at one end of the stamping pin body; the pin head comprises a columnar first pin head part, a columnar second pin head part and a columnar third pin head part sequentially connected; the third pin head part is connected with the punching pin body; the diameters of the first pin head part, the second pin head part and the third pin head part are sequentially increased; the low speed die lower die is cylindrical; a first accommodating groove is formed in one end face of the low speed die lower die; a second accommodating groove for accommodating the second pin head part is formed in the bottom of the first accommodating groove; and a through hole communicatingto the other end face of the low speed die lower die and allowing the first pin head part to penetrate through is formed in the bottom of the second accommodating groove. The low speed die-stamping pin assembly is high in processing precision, pin stamping strength and punching speed, and unlikely to cause break.

Description

technical field [0001] The invention relates to a punching needle and a lower die for LTCC (low temperature co-fired ceramic technology) special punching in the field of microelectronics, in particular to a low-speed die punching needle assembly for punching holes in LTCC green ceramic sheets for electronic products and its processing technology . Background technique [0002] LTCC technology is a new material technology developed by Hughes Company in 1982. It is made of low-temperature sintered ceramic powder into a green ceramic belt with precise thickness and density. Laser, punching needle drilling, microporous grouting, The required circuit pattern is produced by precision conductor paste printing and other processes, and multiple passive components (such as low-capacity capacitors, resistors, filters, impedance converters, couplers, etc.) are embedded in the multilayer ceramic substrate, and then stacked. Pressed together, the inner and outer electrodes can be made of...

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problems existing in the prior art, the present invention provides a low-speed die punching assembly and its processing technology for punching holes in LTCC green ceramic sheets for electronic products. Fast speed, more than 1000 holes per minute, less likely to be interrupted

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