Electrostatic chuck system, apparatus for forming film, adsorption method, method for forming film and manufacturing method of electronic device
A technology for electrostatic chucks and adsorbents, which is applied to the application of electrostatic attraction holding devices, positioning devices, manufacturing tools, etc., and can solve problems such as the control of the electrostatic chuck adsorption force of the undisclosed incision
Pending Publication Date: 2020-05-08
CANON TOKKI CORP
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Problems solved by technology
[0009] However, Patent Document 1 does not disclose the structure of the notch portion such as the electrostatic chuck installation hole and the control of the adsorption force of the electrostatic chuck in such a structure.
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[0041] Hereinafter, preferred embodiments and examples of the present invention will be described with reference to the drawings. However, the following embodiments and examples are merely illustrative of preferred structures of the present invention, and the scope of the present invention is not limited to these structures. In addition, the hardware configuration and software configuration, processing flow, manufacturing conditions, dimensions, materials, shapes, etc. of the devices in the following description are not intended to limit the scope of the present invention to these unless otherwise specified.
[0042] The present invention is applicable to an apparatus for depositing various materials on the surface of a substrate to form a film, and is preferably applicable to an apparatus for forming a thin film (material layer) of a desired pattern by vacuum evaporation. As the material of the substrate, any material such as glass, a film of a polymer material, or metal can ...
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The invention provides an electrostatic chuck system, an apparatus for forming a film, an adsorption method, a method for forming a film and a manufacturing method of an electronic device. The electrostatic chuck system is used for adsorbing an adsorbed member and is characterized in that the system comprises an electrostatic chuck board with at least one incision; the electrostatic chuck board has a first area adjacent with the incision and a second area which is arranged in a manner of being far from the incision than the first area; and the electrostatic attraction at the first area of theelectrostatic chuck board to each unit area of the adsorbed member is larger than the electrostatic attraction at the second area of the electrostatic chuck board to each unit area of the adsorbed member.
Description
technical field [0001] The invention relates to an electrostatic chuck system, a film forming device, an adsorption method, a film forming method and a manufacturing method of electronic equipment. Background technique [0002] In the manufacture of an organic EL display device (organic EL display), when forming an organic light-emitting element (organic EL element; OLED) constituting an organic EL display device, the vapor deposition material evaporated from the vapor deposition source of the film formation device An organic layer or a metal layer is formed by vapor deposition on a substrate through a mask on which a pixel pattern is formed. [0003] In an upward deposition method (upward deposition) film formation device, the deposition source is installed in the lower part of the vacuum chamber of the film formation device, the substrate is arranged in the upper part of the vacuum chamber, and vapor deposition is performed on the lower surface of the substrate. In the va...
Claims
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IPC IPC(8): C23C14/04C23C14/12C23C14/24C23C14/50C23C14/54H01L51/56
CPCC23C14/24C23C14/042C23C14/50C23C14/54C23C14/12H10K71/164H10K71/166H10K71/00H01L21/6833H02N13/00B23Q3/15H01L21/02631H10K71/16
Inventor 柏仓一史石井博
Owner CANON TOKKI CORP