Guiding mechanism and planarization equipment

A technology of guiding mechanism and equipment, applied in grinding/polishing equipment, metal processing equipment, grinding/polishing safety device, etc., can solve problems such as affecting product quality, shaking of polishing head, uneven surface polishing of wafers, etc.

Pending Publication Date: 2020-05-12
SHANGHAI ADVANCED SILICON TECH CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in the process of physical friction, the problem of shaking of the throwing head is...

Method used

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  • Guiding mechanism and planarization equipment
  • Guiding mechanism and planarization equipment
  • Guiding mechanism and planarization equipment

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Embodiment Construction

[0048] In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.

[0049] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected" and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integrated ; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediary, and it can be the internal communication of two components or the interaction relationship between two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention in specific si...

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Abstract

The invention discloses a guiding mechanism and planarization equipment, and relates to the technical field of wafer manufacturing. The guiding mechanism comprises a base, a bearing and a supporting rod arranged on the top of the base, wherein the bearing is connected to the supporting rod in a sleeving manner. The guiding mechanism also comprises an abutting part, wherein the abutting part is fixedly connected to the top of the supporting rod; and an inner ring of the bearing is clamped and fixed between the abutting part and the base. When the base of the guiding mechanism and an outer ringof the bearing are separately connected to two parts which rotate relative to each other, the guiding mechanism can be used as a relative rotation medium between the two parts so as to achieve the rotation guiding of the two rotating parts and ensure the stable rotation of the two parts. The planarization equipment comprises the guiding mechanism and also comprises a planarization wheel, planarization assemblies and a connecting assembly. The base of the guiding mechanism and the outer ring of the bearing are separately connected to the planarization wheel and the connecting assembly which rotate relative to each other, so that the rotation guiding of the planarization wheel and the connecting assembly can be realized so as to further ensure that the planarization assemblies rotate stablyunder the limitation of the connecting assembly.

Description

technical field [0001] The invention relates to the technical field of wafer manufacturing, in particular to a guiding mechanism and polishing equipment. Background technique [0002] Chemical Mechanical Planarization (CMP) is a method of smoothing wafers or other substrate materials by means of chemical etching and mechanical processing. The CMP process includes physical processes and chemical processes. Among them, the chemical process is that the chemicals in the polishing liquid react chemically with the wafer, and generate substances that are easier to remove on the surface of the wafer, while the physical process uses the abrasive particles in the polishing liquid to physically interact with the wafer surface. Rubbing creates a smooth wafer by removing material from its surface. However, in the process of physical friction, the problem of shaking of the throwing head is prone to occur, resulting in uneven polishing of the wafer surface, thereby affecting product quali...

Claims

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Application Information

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IPC IPC(8): B24B37/34B24B37/10B24B53/007B24B37/30B24B27/00B24B55/02B24B47/12
CPCB24B27/0076B24B37/10B24B37/30B24B37/34B24B47/12B24B53/007B24B55/02
Inventor 李洪亮姚钉丁沈思情张俊宝陈猛
Owner SHANGHAI ADVANCED SILICON TECH CO LTD
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