A smt solder joint defect detection method based on iforest model verification
A technology for defect detection and model verification, applied in character and pattern recognition, image data processing, instruments, etc. Size and other issues, to achieve the effect of forming precise solder joints, improving accuracy, and suppressing noise interference
Active Publication Date: 2020-10-16
HUIZHOU GUANGHONG TECH CO LTD
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The disadvantage of these two methods is that they need to rely on the experience of the operator, and due to the limitation of manual experience, these two methods often produce large errors
Although this method has good advantages, it also has deficiencies to a certain extent, mainly in that there are many factors affecting the welding quality of spot welding, such as process parameters (welding current, voltage between electrodes, preloading time, electrode pressure, Welding time, maintenance time, electrode size, etc.) factors and some non-process parameters (welding contact surface state, base metal composition, spot welding machine power supply performance, etc.)
These factors have the characteristics of high nonlinearity and mutual coupling, which make the welding process very complicated, especially the welding nugget of spot welding is in a closed space state, no matter during or after welding. The size of the weld nugget can be directly observed, which increases the difficulty of obtaining the quality information of the weld joint
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[0028] In order to make the purpose, technical solutions and advantages of the present disclosure clearer, the present disclosure will be further described in detail below in conjunction with the accompanying drawings. Apparently, the described embodiments are only some of the embodiments of the present disclosure, not all of them. Based on the embodiments in the present disclosure, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present disclosure.
[0029] Those skilled in the art understand that, as mentioned in the background art, the traditional methods for judging the quality of solder joints are relatively poor. Therefore, it is necessary to propose a method that can effectively improve the quality evaluation of solder joints. In order to make the above objects, features and beneficial effects of the present invention more comprehensible, the present invention will be described in det...
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A SMT solder joint defect detection method based on iForest model verification. By performing local binary pattern value and edge detection on image samples, the binary pattern texture feature vector is obtained, and accurate training samples are obtained according to the isolated forest model constructed and verified. Screen the abnormal samples to make the sample data more accurate, so as to build an accurate BP neural network model, and then obtain the defect detection results of solder joints. The quality evaluation method of the present invention can screen the sample data with the image processing technology and the fast and accurate division technology of the isolated forest model, which improves the accuracy of the sample data, and completes the quality evaluation of the solder joint pictures through the constructed BP neural network model, Precise control over solder joint formation.
Description
technical field [0001] The invention relates to the technical field of intelligent manufacturing, in particular to an SMT solder joint defect detection method based on iForest model verification. Background technique [0002] Surface mount technology (Surface Mounted Technology, SMT) is currently the most popular technology and process in the electronic assembly industry. It is a circuit assembly technology that is mounted on the surface of a printed circuit board (PCB) or other substrates, and soldered and assembled by reflow soldering or dip soldering. [0003] At present, the quality assessment of solder joints usually adopts inspection methods: one is the visual inspection method, with the aid of a magnifying glass with or without illumination and a magnification of 2-5 times, the quality of solder joints is inspected with the naked eye, such as In case of disputes, a magnifying glass with a magnification of 10 times or more can be used to observe, and the quality evalu...
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IPC IPC(8): G06T7/00G06T7/10G06K9/46G06K9/62
CPCG06T7/0004G06T7/10G06T2207/10004G06T2207/20084G06T2207/20081G06T2207/30141G06V10/44G06F18/24323
Inventor 陈均古桂良
Owner HUIZHOU GUANGHONG TECH CO LTD