Wafer retesting method and testing equipment

Abstract

The invention relates to a wafer retesting method and testing equipment. The method comprises the following steps: setting a first area of a wafer, wherein the first area is an area formed by chip areas which do not participate in parameter testing on the wafer; obtaining a second area of the wafer, wherein the second area is an area formed by chip areas with abnormal parameters obtained after thewafer is subjected to the initial parameter test; obtaining a test area of the wafer according to the first area and the second area, wherein the test area is an area formed by chip areas different from the first area in the second area; and testing parameters of each chip area in the test area. By arranging the first area formed by the chip areas which do not participate in the parameter test, the chip areas of the test area are all effective test areas in the retest process, invalid tests in the retest process are reduced, the operation time of wafer retest is shortened, the test efficiencyis improved, the consumption of needle card consumables is reduced, and the production efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor testing, in particular to a method for retesting a wafer and a testing device. Background technique [0002] During the wafer manufacturing process, the electrical characteristics of the wafer may be abnormal due to various reasons (such as incomplete photolithography, excessive etching, etc.). The wafer testing process is the process of finding out and marking bad chip areas (wafers can also be classified according to the test results), and when the wafer is tested on the test equipment, the test may also be bad due to external reasons, such as the first During the test, it may be that the tip of the pin card is dirty (dust, coating on the wafer pad, etc.) or the pressure of the pin card is too light or the position of the pin card is shifted, which may cause the good wafer to be tested as a defective wafer. round. [0003] The traditional wafer test method generally chooses to set one or...

AI Technical Summary

Problems solved by technology

For example, during the initial test, one circle of the outer circle was set to fail, but after the actual test was completed, it was found that the second and third circles of the outer circle were all defective products caused by the manufacturing process. Assume that the defective value is bin2, and the other Some defective bin2s also appear randomly in the chip area. If bin2 needs to be retested during retesting, the traditional test method will retest all bin2s (including the second and third circles of the outer circle). time consuming

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