Printed circuit board processing method and printed circuit board

Abstract

The embodiment of the invention discloses a printed circuit board processing method and a printed circuit board. The method comprises the following steps: electroplating metal particles on the outer wall of the first side of a substrate to form a first coating layer; carrying out patterning to obtain a first pattern layer; electroplating metal particles on the outer wall of a first insulating layer and carrying out patterning to obtain a second pattern layer; electroplating metal particles on the outer wall of the second side of the substrate, and patterning a third coating layer to obtain a third pattern layer; electroplating metal particles on the outer wall of a second insulating layer and carrying out patterning to obtain a fourth pattern layer; electroplating metal particles on the outer wall of a third insulating layer and carrying out patterning to obtain a fifth pattern layer; electroplating metal particles on the outer wall of a fourth insulating layer and carrying out patterning to obtain a sixth pattern layer; drilling plating holes in the substrate comprising the second pattern layer and the fourth pattern layer according to preset positions, and drilling laser holes inthe preset positions on the two sides of the outer wall of a laminated plate. By adopting the scheme, the effect of reducing the production cost can be achieved, and the productivity of the printed circuit board is further improved.

Description

technical field [0001] The embodiments of the present application relate to the technical field of electronic components, and in particular to a method for processing a printed circuit board and a printed circuit board. Background technique [0002] With the development of technology, electronic devices have increasingly become indispensable devices in people's life and work, such as mobile phones, tablets, TVs and other terminals. Contemporary people's life and work are inseparable from these electronic devices. Printed circuit boards are indispensable components in current electronic equipment. [0003] During the research and practice of the existing technology, the inventors of the embodiments of the present application found that most of the printed circuit boards processed by major manufacturers under the current technology are 8-layer and 1-level printed circuit boards. The number of layers is large, so there is a large demand for substrates, dielectric substrates, a...

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Problems solved by technology

[0004] In view of the shortcomings of the above-mentioned prior art, the embodiment of the present application provides a printed circuit board processing method and a printed circuit board to solve the problem of the large demand for substrates, dielectric substrates, and materials during production in the prior art, and many process procedures. , resulting in higher production costs

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