Printed circuit board processing method and printed circuit board

A technology of printed circuit boards and processing methods, which is applied in the direction of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve the problems of large demand, high production cost, and many process procedures, so as to improve productivity, reduce production cost, reduce The effect of the process

Active Publication Date: 2020-05-19
HUIZHOU TCL MOBILE COMM CO LTD
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the shortcomings of the above-mentioned prior art, the embodiment of the present application provides a printed circuit board processing method and a printed circuit board to s

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Printed circuit board processing method and printed circuit board
  • Printed circuit board processing method and printed circuit board
  • Printed circuit board processing method and printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0032] The terms “first”, “second”, etc. in the description and claims of the embodiments of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific sequence or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances so that the embodiments described herein can be implemented in an order other than the content illustrated or described herein. The technical solutions in the embodiments of the present application will be described clearly and completely in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative work shall fall within the protect...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to view more

Abstract

The embodiment of the invention discloses a printed circuit board processing method and a printed circuit board. The method comprises the following steps: electroplating metal particles on the outer wall of the first side of a substrate to form a first coating layer; carrying out patterning to obtain a first pattern layer; electroplating metal particles on the outer wall of a first insulating layer and carrying out patterning to obtain a second pattern layer; electroplating metal particles on the outer wall of the second side of the substrate, and patterning a third coating layer to obtain a third pattern layer; electroplating metal particles on the outer wall of a second insulating layer and carrying out patterning to obtain a fourth pattern layer; electroplating metal particles on the outer wall of a third insulating layer and carrying out patterning to obtain a fifth pattern layer; electroplating metal particles on the outer wall of a fourth insulating layer and carrying out patterning to obtain a sixth pattern layer; drilling plating holes in the substrate comprising the second pattern layer and the fourth pattern layer according to preset positions, and drilling laser holes inthe preset positions on the two sides of the outer wall of a laminated plate. By adopting the scheme, the effect of reducing the production cost can be achieved, and the productivity of the printed circuit board is further improved.

Description

technical field [0001] The embodiments of the present application relate to the technical field of electronic components, and in particular to a method for processing a printed circuit board and a printed circuit board. Background technique [0002] With the development of technology, electronic devices have increasingly become indispensable devices in people's life and work, such as mobile phones, tablets, TVs and other terminals. Contemporary people's life and work are inseparable from these electronic devices. Printed circuit boards are indispensable components in current electronic equipment. [0003] During the research and practice of the existing technology, the inventors of the embodiments of the present application found that most of the printed circuit boards processed by major manufacturers under the current technology are 8-layer and 1-level printed circuit boards. The number of layers is large, so there is a large demand for substrates, dielectric substrates, a...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05K3/46H05K3/18H05K3/42H05K1/02
CPCH05K3/4611H05K3/18H05K3/423H05K3/429H05K1/0298H05K2201/096
Inventor 黄晓天
Owner HUIZHOU TCL MOBILE COMM CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products