[0032] The terms “first”, “second”, etc. in the description and claims of the embodiments of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific sequence or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances so that the embodiments described herein can be implemented in an order other than the content illustrated or described herein. The technical solutions in the embodiments of the present application will be described clearly and completely in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative work shall fall within the protection scope of this application.
[0033] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.
[0034] See figure 1 , figure 1 It is a schematic flowchart of a printed circuit board processing method provided by an embodiment of the present application. Among them, the embodiments of this application include:
[0035] 101. Use electroplating to plate metal particles on the outer wall of the first side of the substrate to form a first coating layer on the outer wall of the first side of the substrate, and pattern the first coating layer to obtain a first patterned layer, wherein , The outer wall of the first pattern layer is provided with a first insulating layer;
[0036] Specifically, in the embodiments of the present application, metal particles are plated on the outer wall of the first side of the substrate by electroplating, and the metal materials are processed by tin-free electroplating to obtain metal particles, and then the metal particles are processed by heating. The metal ions are deposited on the outer wall of the first side of the substrate to form a first coating layer on the outer wall of the first side of the substrate, wherein the thickness of the first coating layer is between 14 μm and 16 μm For example, the thickness of the first coating layer may be 15 μm or 15.5 μm.
[0037] Specifically, in the embodiment of the present application, after the first coating layer is formed on the outer wall of the first side of the substrate, the first coating layer is patterned to obtain the first pattern layer, and the preset pattern is subjected to a development and etching process on the The first patterned layer is obtained by etching the pattern of the first coating layer.
[0038] Optionally, the outer wall of the first pattern layer described in the embodiment of the present application is provided with a first insulating layer. Since a dielectric gap is required between the pattern layer and the pattern layer, the printed circuit board can operate normally. Therefore, the first pattern layer The outer wall is provided with a first insulating layer, and the first insulating layer is a semi-cured board. The first insulating layer in the embodiment of the present application is 1080 polypropylene (PP) with a residual copper rate of 67%, The dielectric constant of the polypropylene is 3.9, wherein the thickness of the first insulating layer is between 78 μm and 81 μm. For example, the first insulating layer may be 80 μm or 80.5 μm.
[0039] Optionally, the model of the substrate described in the embodiment of the application is EM-370(5), and the substrate is halogen-free and has moderate temperature resistance characteristics.
[0040] 102. Plating metal particles on the first insulating layer by electroplating to form a second coating layer on the outer wall of the first insulating layer, and patterning the second coating layer to obtain a second patterned layer;
[0041] Specifically, in the embodiments of the present application, metal particles are plated on the outer wall of the first insulating layer by electroplating, the first side of the substrate and the second side of the substrate are opposite sides, and the metal material is treated by tin-free electroplating , To obtain metal particles, and then process the metal particles by heating to deposit the metal ions on the outer wall of the first insulating layer to form a second coating layer on the outer wall of the first insulating layer, wherein, The thickness of the second coating layer is between 24 μm and 26 μm. For example, the thickness of the second coating layer may be 25 μm or 25.5 μm.
[0042] Specifically, in the embodiment of the present application, after the second coating layer is formed on the outer wall of the first insulating layer, the second coating layer is patterned to obtain the second pattern layer, and the preset pattern is developed and etched on the first pattern layer. The second pattern layer is obtained by etching the pattern of the second coating layer.
[0043] 103. Use electroplating to plate metal particles on the outer wall of the second side of the substrate to form a third coating layer on the outer wall of the second side of the substrate, and pattern the third coating layer to obtain a third patterned layer, wherein , The outer wall of the third pattern layer is provided with a second insulating layer;
[0044] Specifically, in the embodiments of the present application, metal particles are plated on the outer wall of the second side of the substrate by electroplating, and the metal material is processed by tin-free electroplating to obtain metal particles, and then the metal particles are processed by heating. The metal ions are deposited on the outer wall of the second side of the substrate to form a third coating layer on the outer wall of the second side of the substrate, wherein the thickness of the third coating layer is between 14 μm and 16 μm For example, the thickness of the third coating layer may be 15 μm or 15.5 μm.
[0045] Specifically, in the embodiment of the present application, after a third coating layer is formed on the outer wall of the second side of the substrate, the third coating layer is patterned to obtain a third pattern layer, and the preset pattern is subjected to a development and etching process in the The third pattern layer is obtained by etching the pattern of the third coating layer.
[0046] Optionally, the outer wall of the third pattern layer described in the embodiment of the present application is provided with a second insulating layer. Since the pattern layer and the pattern layer require a dielectric interval, the printed circuit board can operate normally. Therefore, the third pattern layer The outer wall is provided with a second insulating layer, and the second insulating layer is a semi-cured board. The second insulating layer in the embodiment of the present application is 1080 polypropylene (PP) with a residual copper rate of 67%, The dielectric constant of the polypropylene is 3.9, wherein the thickness of the second insulating layer is between 78 μm and 81 μm. For example, the second insulating layer may be 80 μm or 80.5 μm.
[0047] 104. Use electroplating to plate metal particles on the second insulating layer to form a fourth coating layer on the outer wall of the second insulating layer, and pattern the fourth coating layer to obtain a fourth pattern layer;
[0048] Specifically, in the embodiments of the present application, metal particles are plated on the outer wall of the second insulating layer by electroplating, and the metal material is processed by tin-free electroplating to obtain metal particles, and then the metal particles are processed by heating to make The metal ions are deposited on the outer wall of the second insulating layer to form a fourth coating layer on the outer wall of the second insulating layer, wherein the thickness of the fourth coating layer is between 24 μm and 26 μm, for example: The thickness of the fourth coating layer may be 25 μm or 25.5 μm.
[0049] Specifically, in the embodiment of the present application, after the fourth coating layer is formed on the outer wall of the second insulating layer, the fourth coating layer is patterned to obtain the fourth pattern layer, and the preset pattern is subjected to a development and etching process on the first pattern layer. The fourth pattern layer is obtained by etching the pattern of the four plating film layers.
[0050] 105. Drill plating holes on the substrate including the second pattern layer and the fourth pattern layer according to a preset position, and the plating holes penetrate the entire substrate including the second pattern layer and the fourth pattern layer , To obtain a substrate containing holes;
[0051] Specifically, in the embodiment of the present application, the substrate containing the second pattern layer and the fourth pattern layer is drilled with plating holes according to a preset position, and the preset position can be set according to the items used in the printed circuit board, for example, The plating hole may be a buried hole.
[0052] 106. Use electroplating to plate metal particles on the outer wall of the third insulating layer to form a fifth plating layer on the outer wall of the third insulating layer, and pattern the fifth plating layer to obtain a fifth patterned layer, which includes The fifth coating layer of the fifth pattern layer is a top layer, and the outer wall of the fifth pattern layer is provided with a solder resist layer;
[0053] Specifically, in the embodiments of the present application, metal particles are plated on the outer wall of the third insulating layer by electroplating, and the metal materials are processed by tin-free electroplating to obtain metal particles, and then the metal particles are processed by heating to make The metal ions are deposited on the outer wall of the third insulating layer to form a fifth coating layer on the outer wall of the third insulating layer, wherein the thickness of the fifth coating layer is between 26 μm and 29 μm, for example : The thickness of the fifth coating layer may be 27 μm or 28 μm.
[0054] Specifically, in the embodiment of the present application, after a fifth coating layer is formed on the outer wall of the third insulating layer, the fifth coating layer is patterned to obtain a fifth pattern layer, and the preset pattern is subjected to a development and etching process on the first The fifth pattern layer is obtained by etching the pattern of the five-plated film layer.
[0055] Optionally, the third insulating layer described in the embodiment of the present application is a prepreg board, and the third insulating layer in the embodiment of the present application is a polypropylene (Polypropylene, PP) type 1067 with a residual copper rate of 71%. The dielectric constant of the polypropylene is 3.8, wherein the thickness of the third insulating layer is between 53 μm and 55 μm. For example, the third insulating layer may be 54 μm or 54.5 μm.
[0056] Specifically, the outer wall of the fifth pattern layer in the embodiment of the present application is provided with a solder resist layer, and the solder resist ink is printed on the outer wall of the fifth pattern layer through a screen to form a solder resist layer. The thickness is between 19 μm and 21 μm, for example, the thickness of the solder resist layer is between 18 μm or 20 μm.
[0057] 107. Use electroplating to plate metal particles on the outer wall of the fourth insulating layer to form a sixth plating layer on the outer wall of the fourth insulating layer, and pattern the sixth plating layer to obtain a sixth patterned layer, which includes The sixth coating layer of the sixth pattern layer is a bottom layer, and the outer wall of the sixth pattern layer is provided with a solder resist layer;
[0058] Specifically, in the embodiments of the present application, metal particles are plated on the outer wall of the fourth insulating layer by electroplating, and the metal material is processed by tin-free electroplating to obtain metal particles, and then the metal particles are processed by heating to make The metal ions are deposited on the outer wall of the sixth insulating layer to form a sixth coating layer on the outer wall of the fourth insulating layer, wherein the thickness of the sixth coating layer is between 26 μm and 29 μm, for example : The thickness of the sixth coating layer may be 27 μm or 28 μm.
[0059] Specifically, in the embodiment of the present application, after the sixth coating layer is formed on the outer wall of the fourth insulating layer, the sixth coating layer is patterned to obtain the sixth pattern layer, and the preset pattern is subjected to a development and etching process on the first pattern layer. The sixth pattern layer is obtained by etching the pattern of the six-plated film layer.
[0060] Optionally, the fourth insulating layer in the embodiment of the application is a semi-cured board, and the fourth insulating layer in the embodiment of the application is a polypropylene (Polypropylene, PP) type 1067 with a residual copper rate of 71%. The dielectric constant of the polypropylene is 3.8, wherein the thickness of the fourth insulating layer is between 53 μm and 55 μm. For example, the fourth insulating layer may be 54 μm or 54.5 μm.
[0061] Specifically, in the embodiment of the present application, the outer wall of the sixth pattern layer is provided with a solder resist layer, and the solder resist ink is printed on the outer wall of the sixth pattern layer through a screen to form a solder resist layer. The thickness is between 19 μm and 21 μm. For example, the thickness of the solder resist layer is 18 μm or 20 μm.
[0062] 108. Laminating the substrate containing holes, the top layer and the bottom layer by pressing;
[0063] Specifically, in the embodiment of the present application, the laminated material layer composed of the pattern layer, the insulating layer, and the base material is laminated together by a lamination process to be heated and pressurized. During the lamination process, the insulating layer prepreg The epoxy resin will be heated and melted, so that the epoxy resin flows, and finally the layers are bonded together by cooling and solidifying the prepreg. The thickness of the laminated board is between 700μm and 900μm, for example: The thickness is between 827μm or 850μm.
[0064] 109. Drill laser holes at preset positions on both sides of the outer wall of the laminated board.
[0065] Specifically, in the embodiment of the present application, laser holes are drilled on both sides of the outer wall of the laminated board by means of laser drilling. The laser drilling method may be photochemical ablation or photothermal ablation, etc., wherein the laser holes include the first A laser hole and a second laser hole, the first laser hole passes through the top layer and the second pattern layer; the second laser hole passes through the bottom layer and the fourth pattern layer.
[0066] Specifically, in the embodiment of the present application, by providing the buried hole and the laser hole, each pattern layer can be connected to the laser hole through the buried hole, so that the printed circuit board can work normally.
[0067] In summary, the embodiments of the present application provide a printed circuit board processing method, by which a 6-layer and 1-stage printed circuit board structure can be obtained by processing, and the designed printed circuit board structure can reduce printing The number of layers of the circuit board structure. This solution reduces the number of layers of the printed circuit board structure, reduces the demand for substrates, dielectric substrates, and materials, reduces the required process procedures, and achieves the effect of reducing production costs, thereby improving the printed circuit board Productivity.
[0068] See figure 2 , figure 2 It is a schematic structural diagram of a printed circuit board 2 provided by an embodiment of the application. The printed circuit board 2 is a printed circuit board 2 after the lamination process and before the laser drilling process. The circuit board 2 is a laminated board, and includes a substrate b containing holes, a top layer a, and a bottom layer c. The substrate 21 has a first side and a second side, and the first side and the second side are opposite sides; The top layer a covers the first side, the bottom layer c covers the second side; the hole-containing substrate b has a first pattern layer L3, a second pattern layer L2, a third pattern layer L4, and a fourth pattern layer L5, a first insulating layer 211, a second insulating layer 214, the first pattern layer L3 covers the outer wall of the first side of the base material 21, and the first insulating layer 211 covers the first pattern layer L3 The second pattern layer L2 covers the outer wall of the first insulating layer 211, the third pattern layer L4 covers the outer wall of the second side of the substrate 21, and the second insulating layer 214 covers On the outer wall of the third pattern layer L4, the fourth pattern layer L5 covers the outer wall of the second insulating layer 214, and the substrate including the second pattern layer L2 and the fourth pattern layer L5 has a plating layer Hole 217; the top layer a has a third insulating layer 212 and a fifth pattern layer L1, the fifth pattern layer L1 covers the outer wall of the third insulating layer 212; the bottom layer b has a fourth insulating layer 215 and The sixth pattern layer L6 covers the outer wall of the fourth insulating layer 215. In the embodiment of the present application, laser holes are drilled on both sides of the outer wall of the laminated board by means of laser drilling. The laser drilling method may be photochemical ablation or photothermal ablation, etc., wherein the laser holes include first laser holes and The second laser hole, the first laser hole passes through the top layer a and the second pattern layer L2; the second laser hole passes through the bottom layer b and the fourth pattern layer L5.
[0069] The embodiments of this application are used in the QM215 platform, but are not limited to use in the QM215 platform, and are not limited here.
[0070] In summary, the embodiments of the present application provide a printed circuit board. By providing a printed circuit board structure with 6 layers and 1 level, the designed printed circuit board structure can reduce the number of layers of the printed circuit board structure. This solution reduces the number of printed circuit board structure layers, reduces the demand for substrates, dielectric substrates, and materials, reduces the required process procedures, and achieves the effect of reducing production costs, thereby increasing the productivity of printed circuit boards.
[0071] The embodiment of the application also provides a mobile terminal. The printed circuit board provided in the embodiment of the application can be used in the mobile terminal, such as image 3 As shown, it shows a schematic structural diagram of a terminal involved in an embodiment of the present application. The terminal can be a mobile phone, a computer, a digital broadcasting terminal, a messaging device, a game console, a tablet device, a medical device, a fitness device, or a personal Digital assistants, etc., specifically:
[0072] Such as image 3 As shown, the mobile terminal may include a radio frequency (RF) circuit 301, a memory 302 including one or more computer-readable storage media, an input unit 303, a display unit 304, a sensor 305, an audio circuit 306, a wireless security A true (Wireless Fidelity, Wi-Fi) module 307 includes a processor 308 with one or more processing cores, a power supply 309 and other components. The above-mentioned components can be integrated in the printed circuit board provided in the embodiments of the present application, and those skilled in the art can understand that, image 3 The terminal structure shown in does not constitute a limitation on the terminal, and may include more or fewer components than shown in the figure, or combine some components, or arrange different components. among them:
[0073] The RF circuit 301 can be used for receiving and sending signals in the process of sending and receiving information or talking. In particular, after receiving the downlink information of the base station, it is processed by one or more processors 308; in addition, the uplink data is sent to the base station. . Generally, the RF circuit 301 includes, but is not limited to, an antenna, at least one amplifier, a tuner, one or more oscillators, a Subscriber Identity Module (SIM) card, a transceiver, a coupler, and a low noise amplifier (LowNoise Amplifier). , LNA), duplexer, etc. In addition, the RF circuit 301 can also communicate with the network and other devices through wireless communication. The wireless communication can use any communication standard or protocol, including but not limited to Global System of Mobile communication (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (Code Division Multiple Access). Multiple Access (CDMA), Wideband Code Division Multiple Access (WCDMA), Long Term Evolution (LTE), Email, Short Messaging Service (SMS), etc.
[0074] The memory 302 can be used to store software programs and modules. The processor 308 executes various functional applications and data processing by running the software programs and modules stored in the memory 302. The memory 302 may mainly include a storage program area and a storage data area. The storage program area may store an operating system, an application program required by at least one function (such as a sound playback function, an image playback function, etc.), etc.; Data (such as audio data, phone book, etc.) created by the use of the mobile terminal. In addition, the memory 302 may include a high-speed random access memory, and may also include a non-volatile memory, such as at least one magnetic disk storage device, a flash memory device, or other volatile solid-state storage devices. Correspondingly, the memory 302 may further include a memory controller to provide the processor 308 and the input unit 303 to access the memory 302.
[0075] The input unit 303 can be used to receive input digital or character information, and generate keyboard, mouse, joystick, optical or trackball signal input related to user settings and function control. Specifically, in a specific embodiment, the input unit 303 may include a touch-sensitive surface and other input devices. A touch-sensitive surface, also called a touch screen or a trackpad, can collect user touch operations on or near it (for example, the user uses any suitable objects or accessories such as fingers, stylus, etc.) on the touch-sensitive surface or on the touch-sensitive surface. Operation near the surface), and drive the corresponding connection device according to the preset program. Optionally, the touch-sensitive surface may include two parts: a touch detection device and a touch controller. Among them, the touch detection device detects the user's touch position, and detects the signal brought by the touch operation, and transmits the signal to the touch controller; the touch controller receives the touch information from the touch detection device, converts it into contact coordinates, and then sends it To the processor 308, and can receive and execute the commands sent by the processor 308. In addition, multiple types of resistive, capacitive, infrared, and surface acoustic waves can be used to realize touch-sensitive surfaces. In addition to the touch-sensitive surface, the input unit 303 may also include other input devices. Specifically, other input devices may include, but are not limited to, one or more of a physical keyboard, function keys (such as volume control buttons, switch buttons, etc.), trackball, mouse, and joystick.
[0076] The display unit 304 may be used to display information input by the user or information provided to the user and various graphical user interfaces of the terminal. These graphical user interfaces may be composed of graphics, text, icons, videos, and any combination thereof. The display unit 304 may include a display panel. Optionally, the display panel may be configured in the form of a liquid crystal display (Liquid Crystal Display, LCD), an organic light-emitting diode (Organic Light-Emitting Diode, OLED), etc. Further, the touch-sensitive surface can cover the display panel. When the touch-sensitive surface detects a touch operation on or near it, it is transmitted to the processor 308 to determine the type of the touch event, and then the processor 308 displays the display panel according to the type of the touch event. Corresponding visual output is provided on the panel.
[0077] The mobile terminal may also include at least one sensor 305, such as a light sensor, a motion sensor, and other sensors. Specifically, the light sensor may include an ambient light sensor and a proximity sensor. The ambient light sensor can adjust the brightness of the display panel according to the brightness of the ambient light, and the proximity sensor can turn off the display panel and/or the backlight when the terminal is moved to the ear . As a kind of motion sensor, the gravity acceleration sensor can detect the magnitude of acceleration in various directions (usually three-axis), and can detect the magnitude and direction of gravity when it is stationary. It can be used to identify mobile phone posture applications (such as horizontal and vertical screen switching, related Games, magnetometer posture calibration), vibration recognition related functions (such as pedometer, percussion), etc.; as for other sensors such as gyroscopes, barometers, hygrometers, thermometers, infrared sensors, etc., which can be configured on the terminal, I will not here Go into details. In the embodiment of the present application, the light sensor in the terminal is used to perform light compensation after image processing is performed to correct the image to be processed, and restore the original color of the image to be processed.
[0078] The audio circuit 306, speakers, and microphones can provide an audio interface between the user and the terminal. The audio circuit 306 can transmit the electric signal after the conversion of the received audio data to the speaker, which is converted into a sound signal for output; on the other hand, the microphone converts the collected sound signal into an electric signal, which is received by the audio circuit 306 and then converted The audio data is processed by the audio data output processor 308, and then sent to, for example, another terminal via the RF circuit 301, or the audio data is output to the memory 302 for further processing. The audio circuit 306 may also include an earplug jack to provide communication between a peripheral earphone and the terminal.
[0079] Wi-Fi is a short-distance wireless transmission technology. Through the Wi-Fi module 307, the terminal can help users send and receive e-mails, browse web pages, and access streaming media. It provides users with wireless broadband Internet access. although image 3 The Wi-Fi module 307 is shown, but it is understandable that it is not an essential component of the terminal, and can be omitted as needed without changing the essence of the invention.
[0080] The processor 308 is the control center of the terminal. It uses various interfaces and lines to connect various parts of the entire mobile phone, and executes by running or executing software programs and/or modules stored in the memory 302, and calling data stored in the memory 302. Various functions of the terminal and processing data, so as to monitor the mobile phone as a whole. Optionally, the processor 308 may include one or more processing cores; preferably, the processor 308 may integrate an application processor and a modem processor, where the application processor mainly processes the operating system, user interface, and application programs, etc. , The modem processor mainly deals with wireless communication. It can be understood that the foregoing modem processor may not be integrated into the processor 308. In the embodiment of the present application, the processor 308 can control the image processing device to perform image processing on the image to be processed.
[0081] The mobile terminal also includes a power source 309 (such as a battery) for supplying power to various components. Preferably, the power source can be logically connected to the processor 308 through a power management system, so that functions such as charging, discharging, and power management are realized through the power management system. The power supply 309 may also include any components such as one or more DC or AC power supplies, a recharging system, a power failure detection circuit, a power converter or inverter, and a power status indicator.
[0082] Although not shown, the mobile terminal may also include a camera, a Bluetooth module, etc., which will not be repeated here. Specifically, in this embodiment, the processor 308 in the terminal will load the executable file corresponding to the process of one or more application programs into the memory 302 according to the following instructions, and the processor 308 will run and store the executable file in the memory. 302 in the application to achieve various functions.
[0083] The above is a detailed introduction to a printed circuit board processing method and a printed circuit board provided in the embodiments of the application. Specific examples are used in this article to explain the principles and implementations of the embodiments of the application. The description of the above embodiments is only It is used to help understand the methods and core ideas of the embodiments of this application; at the same time, for those skilled in the art, according to the ideas of the embodiments of this application, there will be changes in the specific implementation and the scope of application. As mentioned, the content of this specification should not be construed as a limitation to the embodiments of this application.
