LED dispensing method

Abstract

The invention discloses an LED dispensing method. The LED dispensing method comprises the steps of: S1, fixing an FPC flexible circuit board; S2, printing solder paste on the FPC flexible circuit board; S3, performing dispensing at the interval positions of bonding pads of the FPC flexible circuit board; S4, electrically installing the LED on the solder paste of the bonding pad; S5, raising the temperature to a glue fixing temperature so as to cure the glue at the interval position of the bonding pad; and S6, enabling the reflow soldering to continue to be heated to the solder paste curing temperature, so that the LED welding pins and the bonding pads of the FPC are subjected to curing connection by heating the solder paste. According to the LED dispensing method, the adhesive force of theLED is increased, the process is simple and convenient, the product yield is high, and the LED dispensing method can be used for a backlight source of a narrow-frame backlight module.

Description

technical field [0001] The invention relates to the field of LED package dispensing process, in particular to a method for LED dispensing. Background technique [0002] Existing LED packaging includes: solid crystal, wire bonding, dispensing, light splitting and packaging. The existing dispensing method is to vertically align the dispensing head with packaging glue on the top of the LED chip, then control the glue, and then Move the dispensing head vertically upwards to dispense the next LED chip. This kind of glue is aligned on the top of the LED chip. Since the slot inside the PPA bracket bowl is lower than the position of the silver plating layer, if the glue is dispensed from a non-slot position, the packaging glue will not flow evenly and appear due to the existence of uneven positions. Glue overflow phenomenon. [0003] In order to solve the above problems, a new dispensing method has emerged, that is, the dispensing head with encapsulation glue is vertically lowered...

AI Technical Summary

Problems solved by technology

This kind of glue is aligned on the top of the LED chip. Since the slot inside the PPA bracket bowl is lower than the position of the silver plating layer, if the glue is dispensed from a non-slot position, the packaging glue will not flow evenly and appear due to the existence of uneven positions. Glue overflow phenomenon

[0003] In order to solve the above problems, a new dispensing method has emerged, that is, the dispensing head with encapsulation glue is vertically lowered and aligned with the position near the fishing groove in the plastic bracket of the LED chip, and then the glue is controlled, then the dispensing head is raised, and finally moved The dispensing head goes to the position of another LED chip for dispensing operation, but since the dispensing position is close to the position of the plastic bracket, and one-time glue is released at this position, after the glue is discharged, the packaging glue is combined with the side close to the plastic bracket Glue overflow and glue phenomenon will affect the appearance of LED, and glue overflow and glue will cause the problem that the suction nozzle cannot hold the bracket during the subsequent moving of the bracket, reducing production efficiency

[0004] At present, with the thinning and thinning of electronic products, the frame of the backlight module becomes narrower, and the size of the LED at the frame position also becomes smaller.

Insufficient LED adhesion can easily cause the LED lamp to fall off, affecting the brightness and uniformity of the display screen

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