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Preparation method of epoxy resin-based composite material with high thermal conductivity ordered structure

A technology of epoxy resin and composite materials, which is applied in the field of electric field regulation of epoxy resin-based micro-nano composite materials, can solve the problems of reducing manufacturability, electrical insulation performance and mechanical properties, and achieve saving raw materials, improving thermal conductivity, The effect of reducing viscosity

Pending Publication Date: 2020-05-29
苏州巨峰先进材料科技有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, at home and abroad, there are many thermal conductivity fillers filled with epoxy resin to improve the thermal conductivity of the epoxy resin; but the filled high thermal conductivity epoxy resin-based composite material only has the thermal conductivity of the composite material when the amount of filler continues to increase to a certain critical value. It can be significantly improved, and with the increase of filler content, the viscosity of the composite material increases sharply, which significantly reduces its manufacturability, electrical insulation performance and mechanical properties, etc.

Method used

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  • Preparation method of epoxy resin-based composite material with high thermal conductivity ordered structure
  • Preparation method of epoxy resin-based composite material with high thermal conductivity ordered structure
  • Preparation method of epoxy resin-based composite material with high thermal conductivity ordered structure

Examples

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Effect test

Embodiment 1

[0035] Example 1: Preparation of Epoxy Resin-Based Composite Materials with High Thermal Conductivity Ordered Structure

[0036]

[0037] The specific preparation method is as follows:

[0038] 1) Heat the liquid crystal epoxy at 150°C to make it melt into a liquid; the drying condition for the filler is: dry in a drying oven at 80°C for 3 hours. It is characterized in that the drying conditions of the common epoxy resin, curing agent and coupling agent are: drying at 60°C for 20 minutes to reduce the viscosity;

[0039] 2) Weigh 150 parts of quasi-flaky alumina in proportion with a precision electronic balance, add 6 parts of coupling agent, and fully stir the mixture to obtain a high thermal conductivity filler system;

[0040] 3) Fully stir the molten liquid crystal epoxy resin and ordinary epoxy resin with a planetary mixer, then add the filler system to the mixture, and stir with a planetary stirring defoamer.

[0041] 5) Heat the mixed liquid at 100°C for 15 minutes...

Embodiment 1

[0045] The epoxy resin-based composite material with high thermal conductivity and ordered structure prepared in Example 1 has a filling content of 37%, and a thermal conductivity of 2.9 W / (m·K), which is 16 times that of ordinary epoxy resin.

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Abstract

The invention discloses a preparation method of an epoxy resin-based micro-nano composite material with a high thermal conductivity ordered structure under the regulation and control of an electric field. A certain amount of liquid crystal epoxy structure units are introduced while common epoxy resin is filled with a heat-conducting filler, directional ordered configuration of a liquid crystal domain and the heat-conducting filler in a composite material is achieved through electric field regulation and control, and thus an epoxy resin-based micro-nano composite dielectric with high heat conductivity is obtained under the low content.

Description

technical field [0001] The invention relates to a method for preparing a composite material, in particular to a method for regulating an electric field of an epoxy resin-based micro-nano composite material with a highly thermally conductive ordered structure. Background technique [0002] With the development of electrical and electronic equipment in the direction of high power density, miniaturization, light weight, and high integration, the temperature rise of equipment is serious, which will accelerate the aging and failure of insulating dielectrics, and greatly reduce the reliability and life of electrical and electronic equipment. Epoxy resins are widely used in the fields of electrical equipment insulation and electronic packaging due to their excellent adhesion, corrosion resistance and dielectric properties. However, the thermal conductivity of pure epoxy resin is very low, which cannot meet the current development needs. Therefore, in order to improve the heat diss...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K9/06C08K3/22C08J3/00
CPCC08L63/00C08J3/00C08K2201/011C08K2003/2227C08K2201/003C08L2205/025C08J2363/00C08J2463/00C08K9/06C08K3/22
Inventor 田付强夏宇
Owner 苏州巨峰先进材料科技有限公司