Preparation method of epoxy resin-based composite material with high thermal conductivity ordered structure
A technology of epoxy resin and composite materials, which is applied in the field of electric field regulation of epoxy resin-based micro-nano composite materials, can solve the problems of reducing manufacturability, electrical insulation performance and mechanical properties, and achieve saving raw materials, improving thermal conductivity, The effect of reducing viscosity
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Embodiment 1
[0035] Example 1: Preparation of Epoxy Resin-Based Composite Materials with High Thermal Conductivity Ordered Structure
[0036]
[0037] The specific preparation method is as follows:
[0038] 1) Heat the liquid crystal epoxy at 150°C to make it melt into a liquid; the drying condition for the filler is: dry in a drying oven at 80°C for 3 hours. It is characterized in that the drying conditions of the common epoxy resin, curing agent and coupling agent are: drying at 60°C for 20 minutes to reduce the viscosity;
[0039] 2) Weigh 150 parts of quasi-flaky alumina in proportion with a precision electronic balance, add 6 parts of coupling agent, and fully stir the mixture to obtain a high thermal conductivity filler system;
[0040] 3) Fully stir the molten liquid crystal epoxy resin and ordinary epoxy resin with a planetary mixer, then add the filler system to the mixture, and stir with a planetary stirring defoamer.
[0041] 5) Heat the mixed liquid at 100°C for 15 minutes...
Embodiment 1
[0045] The epoxy resin-based composite material with high thermal conductivity and ordered structure prepared in Example 1 has a filling content of 37%, and a thermal conductivity of 2.9 W / (m·K), which is 16 times that of ordinary epoxy resin.
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