Graphite heat conduction and heat dissipation adhesive tape
A graphite heat conduction and tape technology, applied in adhesives, film/flake adhesives, coatings, etc., can solve the problems of tape overheating, uneven heat dissipation, poor reliability performance, etc., to improve the performance of heat conduction and heat dissipation. , Improve the heat dissipation effect and reduce the effect of voids
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Embodiment 1
[0023] A graphite heat-dissipating adhesive tape, comprising a release film layer, the release film layer is made of PET material, one surface of the PET release film layer is covered with a first high temperature resistant adhesive layer, the first high temperature resistant adhesive layer is The other surface is covered with a graphite layer, and the graphite sheet size of the graphite layer is 100-220 μm. The other surface of the graphite layer is covered with a copper foil, the thickness of the copper foil is 5-8 μm, the other surface of the copper foil is covered with a second high temperature resistant adhesive layer, and the other surface of the second high temperature resistant adhesive layer is covered with Infrared radiation heat dissipation coating, the infrared radiation heat dissipation coating is composed of titanium dioxide, silicon dioxide and silicone resin.
[0024] The present invention obtains by following process method, and this process method comprises t...
Embodiment 2
[0030] A graphite heat-dissipating adhesive tape, comprising a release film layer, the release film layer is made of PET material, one surface of the PET release film layer is covered with a first high temperature resistant adhesive layer, the first high temperature resistant adhesive layer is The other surface is covered with a graphite layer, and the graphite sheet size of the graphite layer is 100-220 μm. The other surface of the graphite layer is covered with an aluminum foil, the thickness of the copper foil is 8-10 μm, the other surface of the copper foil is covered with a second high temperature resistant adhesive layer, and the other surface of the second high temperature resistant adhesive layer is covered with an infrared Radiation heat dissipation coating, infrared radiation heat dissipation coating is composed of titanium dioxide, silicon dioxide and silicone resin.
[0031] The present invention obtains by following process method, and this process method comprise...
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Abstract
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