Production process of high-frequency and high-speed LCP copper-clad plate and equipment thereof
A copper-clad laminate and high-speed technology, which is applied in the production process and equipment field of high-frequency and high-speed LCP copper-clad laminate materials, can solve problems such as material constraints, technical hidden dangers, and urgent needs of LCP copper-clad laminates, and achieve consistent performance and uniform temperature changes consistent effect
Inactive Publication Date: 2020-06-09
上海联净电子科技有限公司
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Problems solved by technology
At present, only a very small number of manufacturers in Japan and the United States can effectively provide commercial LCP films, and implement strict export restrictions, which seriously restricts the urgent demand for LCP copper clad laminates downstream. At present, there is no qualified manufacturer that can provide LCP films in my country , so that there are major material constraints and technical hidden dangers in the process of promoting the industrialization of 5G technology in China
Method used
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[0058] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided in order to give a thorough understanding of embodiments of the present disclosure. However, one skilled in the art will appreciate that the technical solutions of the present disclosure may be practiced without one or more of the specific details, or that other methods, materials, devices, etc. may be employed. In other instances, well-known technical solutions have not...
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The invention provides a high-frequency and high-speed LCP copper-clad plate production device and a production process. The device comprises a screw extruder; two copper foil unwinding mechanisms used for driving the copper foil to be unwound; and at least one hot pressing roller set, wherein each hot pressing roller set comprises two hot pressing rollers which are oppositely arranged; the LCP resin is melted by the screw extruder and then extruded and cast to the copper foil between the two hot-pressing rollers which are arranged side by side, and the melted LCP resin and the copper foil arehot-pressed and compounded by the hot-pressing roller set to form the copper-clad plate; during compounding and after-treatment, a protective film is attached to the copper foil, and stripping is conducted before film-coated copper is rolled; each after-finishing unit comprises at least two groups of after-finishing hot-pressing rollers and two groups of cooling rollers, and the after-finishing hot-pressing rollers and the cooling rollers are symmetrically distributed on two sides of the copper-clad plate; a finished product winding mechanism is used for driving the cooled copper-clad plate to be wound; the process limitation that the LCP resin needs to be subjected to film forming firstly to produce the copper-clad plate is overcome, the production speed of the copper-clad plate is increased, and the product quality of the copper-clad plate is improved.
Description
technical field [0001] The present invention relates to a production technology of a copper clad laminate material used in the 5G technical field, in particular to a production process and equipment of a high frequency and high speed LCP copper clad laminate material. Background technique [0002] Compared with 1G-4G communication technology, 5G communication equipment has a higher frequency and faster transmission speed, which puts higher and stricter requirements on the technical indicators such as the dielectric constant and dielectric loss factor of the electronic materials used in the equipment. Require. Traditional epoxy-based copper-clad laminates and polyimide-based copper-clad laminates cannot meet the electrical performance requirements necessary for 5G high-frequency communications. Liquid-Crystal-Polymer (LCP) polymer materials have extremely low dielectric constant and dielectric loss factor, and have the characteristics of low moisture absorption, good chemica...
Claims
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Patent Timeline
Login to View More IPC IPC(8): B32B37/06B32B37/08B32B37/10B32B37/15B32B38/00B32B39/00
CPCB32B37/06B32B37/10B32B37/08B32B37/153B32B38/00B32B39/00
Inventor 周黄晴王明陈振周利文元庆刘志浩邹斌
Owner 上海联净电子科技有限公司