Plastic edge covering plate for electronic equipment and secondary plastic forming method

A technology of electronic equipment and plastic molding, applied in the direction of electrical equipment shell/cabinet/drawer, application, electrical components, etc., can solve the problems of reducing sheet deformation, large shrinkage, sheet deformation, etc., and achieve the effect of reducing sheet deformation.

Active Publication Date: 2020-06-12
合肥山秀碳纤科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a plastic edge-wrapped board for electronic equipment and a secondary plastic molding method, which solves the problem in the prior art that the edge of the board is wrapped with plastic in a one-time molding method, and the shrinkage of the plastic is large after molding, which easily causes deformation of the board. Technical problem, achieved the technical effect of wrapping plastic on the edge of the plate by secondary molding to reduce the deformation of the plate

Method used

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  • Plastic edge covering plate for electronic equipment and secondary plastic forming method
  • Plastic edge covering plate for electronic equipment and secondary plastic forming method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] The embodiment of the present invention provides a plastic edge-wrapped sheet for electronic equipment, please refer to the attached Figure 1-2 , used to make housings for electronic devices, the plate includes:

[0035] board body 1;

[0036] Specifically, the board body 1 is a board with a certain shape and a certain shape, and a plurality of the board bodies 1 are assembled together to form a casing, and electronic equipment is arranged in the casing.

[0037] M first plastic bodies 2, the M first plastic bodies 2 are arranged on the edge of the upper surface of the board body 1;

[0038] Further, when M≧2, a first space is provided between two adjacent first plastic bodies 2 , and the second plastic body 3 fills a plurality of the first spaces.

[0039] Specifically, the M first plastic bodies 2 are arranged on the edge of the upper surface of the board body 1 through injection molding process, and the M first plastic bodies 2 are combined with the board body 1, ...

Embodiment 2

[0069] This application also provides a secondary plastic molding method for making the plastic edge-wrapped board, please refer to the attached Figure 1-2 , the secondary plastic molding method includes:

[0070] Step 1: placing the plate body 1 in a first mold;

[0071] Step 2: pouring the first plastic material into the first mold to form the first plastic body 2;

[0072] Step 3: After the first plastic material is solidified, remove the first mold;

[0073] Step 4: placing the board body 1 including the first plastic body 2 in a second mold;

[0074] Step 5: pouring a second plastic material into the second mold to form the second plastic body 3;

[0075] Step 6: After the second plastic material is solidified, remove the second mold.

[0076] Specifically, the first plastic material and the second plastic material can be PC+ABS, PC+10%-60% glass fiber, PA+10%-60% glass fiber, PPS+10%-60% One of the glass fibers, but not limited to the above several materials. The ...

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Abstract

The embodiment of the invention provides a plastic edge covering plate for electronic equipment and a secondary plastic forming method. The plastic edge covering plate is used for manufacturing a shell of an electronic device. The plastic edge covering plate comprises a plate body, M first plastic bodies and a second plastic body, the M first plastic bodies are arranged on the edge of the upper surface of the plate body, each first plastic body comprises a first surface, a second surface, a third surface, a first edge and a second edge, and the N grooves are formed in the second surface. The second plastic body wraps the third surface, the first edge, the second edge and the filling groove and is connected with the side edge of the plate body; wherein M is a positive integer, and N is 0 ora positive integer. The technical problems that in the prior art, the edge of a plate is wrapped with plastic in a one-time forming mode, the shrinkage amount is large after plastic forming, and plate deformation is likely to be caused are solved, and the technical effects that the edge of the plate is wrapped with plastic in a two-time forming mode, and the plate deformation degree is reduced are achieved.

Description

technical field [0001] The invention relates to the technical field of electronic equipment shells, in particular to a plastic edge-wrapping plate used for electronic equipment and a secondary plastic molding method. Background technique [0002] At present, the housing of an electronic device is usually assembled from a plurality of formed plates. Plastic materials are placed on the edges of the plates by in-mold molding to completely wrap the edges of the plates, which not only increases the airtightness of the shell, but also reduces the The vibration between the plates on the shell reduces the noise of the shell. [0003] However, the inventors of the present application have found that the above-mentioned prior art has at least the following technical problems: [0004] The plastic material is directly wrapped on the edge of the board by one-time molding in the mold. After the plastic material is formed, it shrinks a lot, causing the board to deform, making the appeara...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/06B29C45/14
CPCB29C45/14B29L2031/34H05K5/06H05K5/065
Inventor 张春笋
Owner 合肥山秀碳纤科技有限公司
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