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Varied component density for thermal isolation

A component, low-density area technology, applied in the field of variable component density for thermal insulation, can solve problems such as affecting strength and brittleness

Active Publication Date: 2020-06-12
VARIAN SEMICON EQUIP ASSOC INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, varying the thickness of a component can affect its strength and brittleness

Method used

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  • Varied component density for thermal isolation
  • Varied component density for thermal isolation
  • Varied component density for thermal isolation

Examples

Experimental program
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Embodiment Construction

[0019] As mentioned above, varying the amount of material is one way to create a thermal gradient in a component. Conventional subtractive processes remove material from certain regions to form thin regions. In certain embodiments, a plurality of holes may be provided throughout a region of the member to reduce the thermal conductivity of the region. However, as noted above, thinning a component can affect its strength and durability.

[0020] Additive manufacturing techniques allow components to be manufactured in different ways. Instead of removing material as is done traditionally, additive manufacturing techniques form components layer by layer. One such additive manufacturing technique is called Direct Metal Laser Sintering (DMLS), which uses a powder bed and a laser. Apply a thin layer of powder to the workpiece space. A laser is used to sinter the powder only in the areas where the component will be formed. The remainder of the metal powder remains and forms a powd...

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PUM

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Abstract

A system that utilizes a component that controls thermal gradients and the flow of thermal energy by variation in density is disclosed. Methods of fabricating the component are also disclosed. The component is manufactured using additive manufacturing. In this way, the density of different regions of the component can be customized as desired. For example, a lattice pattern may be created in the interior of a region of the component to reduce the amount of material used. This reduces weight and also decreases the thermal conduction of that region. By using low density regions and high densityregions, the flow of thermal energy can be controlled to accommodate the design constraints.

Description

technical field [0001] Embodiments of the present disclosure relate to systems in which the density of components is varied for thermal management. Background technique [0002] The fabrication of semiconductor devices involves multiple discrete and complex processes. These processes may be performed using a workpiece handling system. For example, such a workpiece processing system may be a beamline ion implantation system or a plasma processing chamber. In certain embodiments, the temperature of components in a workpiece handling system is highly dependent on the process being performed. [0003] For example, feed gas may be ionized in the ion source and extracted through extraction openings provided on the extraction plate. Such extraction plates can be made of metal. If the temperature of the extraction plate near the extraction opening is sufficiently low, the feed gas may condense on the extraction plate close to the extraction opening. This condensed feed gas beco...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01J37/16H01J37/317
CPCH01J27/024H01J37/3171H01J37/08H01J2237/0817H01J2237/061H01J2237/0213H01J37/16H01J37/3172G05B13/021H01L21/425H01J37/075H01L21/265H01J27/205
Inventor 亚当·M·麦劳克林奎格·R·钱尼
Owner VARIAN SEMICON EQUIP ASSOC INC