Various aspects of the invention provide improved approaches and methods for efficiently: Vaporizing 
decaborane and other heat-sensitive materials via a novel 
vaporizer and vapor 
delivery system; Delivering a controlled, low-pressure drop flow of vapors, e.g. 
decaborane, into the 
ion source; Ionizing the 
decaborane into a large fraction of B10Hx+; Preventing 
thermal dissociation of decaborane; Limiting charge-exchange and low energy 
electron-induced fragmentation of B10Hx+; Operating the 
ion source without an arc 
plasma, which can improve the emittance properties and the purity of the beam; Operating the 
ion source without use of a strong applied 
magnetic field, which can improve the emittance properties of the beam; Using, a novel approach to produce 
electron impact ionizations without the use of an arc 
discharge, by incorporation of an externally generated, broad directional 
electron beam which is aligned to pass through the 
ionization chamber to a thermally isolated 
beam dump;. Providing production-worthy dosage rates of 
boron dopant at the 
wafer; Providing a hardware design that enables use also with other dopants, especially using novel 
hydride, 
dimer-containing, and 
indium- or 
antimony-containing temperature-sensitive starting materials, to further enhance the economics of use and production worthiness of the novel source design and in many cases, reducing the presence of contaminants; Matching the ion 
optics requirements of the 
installed base of ion implanters in the field; Eliminating the 
ion source as a source of transition metals 
contamination, by using an external and preferably remote 
cathode and providing an 
ionization chamber and extraction aperture fabricated of non-contaminating material, e.g. 
graphite, 
silicon carbide or aluminum; Enabling retrofit of the new 
ion source into the 
ion source design space of existing Bernas source-based ion implanters and the like or otherwise enabling compatibility with other ion source designs; Using a 
control system in retrofit installations that enables retention of the installed 
operator interface and control techniques with which operators are already familiar; Enabling convenient handling and replenishment of the 
solid within the 
vaporizer without substantial down-time of the implanter; Providing internal adjustment and control techniques that enable, with a single design, matching the dimensions and intensity of the zone in which 
ionization occurs to the beam line of the implanter and the requirement of the process at hand; Providing novel approaches, starting materials and conditions of operation that enable the making of future generations of 
semiconductor devices and especially 
CMOS source / drains and extensions, and 
doping of 
silicon gates.