Layered entity manufacturing device for rapid separation of computer mainboard melt adhesive film

Abstract

The invention relates to the related technical field of layered entity manufacturing, in particular to a layered entity manufacturing device for rapid separation of computer mainboard melt films. Thedevice includes a mounting base, a first cylinder is screwed on the surface of the mounting base; the surface of the first cylinder is screwed with a workbench; a clamping frame is welded to the surface of the connecting base. The inner wall of the workbench is in threaded connection with a fourth air cylinder. The clamping plate and the positioning clamping plate are extruded on the surface of the computer mainboard; the surfaces of the positioning clamping plates are sleeved with springs; the beneficial effects are that: the device is suitable for large-scale production; after the forming ofone computer main board is completed; the second cylinder and the first cylinder are adjusted upwards and downwards respectively; the material belt moves upwards, the formed computer mainboard movesdownwards, rapid separation of the material belt and the computer mainboard is achieved, the forming efficiency is improved, meanwhile, when the material belt ascends, the material belt is extruded bythe material guide roller and the material pressing roller, the material belt is prevented from wrinkling, then the secondary machining quality is guaranteed, and the computer mainboard forming device is suitable for popularization.

Description

technical field [0001] The invention relates to the related technical field of layered entity manufacturing, in particular to a layered entity manufacturing device for rapid separation of computer motherboard melt adhesive films. Background technique [0002] Layered solid molding is also called lamination preparation technology in a narrow sense. This technology uses thin sheet materials, lasers, and hot-melt adhesives to make laminated structures. The system mainly includes computers, numerical control systems, raw material storage and transportation components, thermal bonding Parts, laser cutting system, liftable workbench, etc., the laser cutter will cut the film along the cross-sectional contour of the workpiece, and the thermal bonding parts will bond the films in the forming area layer by layer until the workpiece is fully formed. However, the layered entity manufacturing device still has the following disadvantages when manufacturing computer motherboards: [0003]...

AI Technical Summary

Problems solved by technology

[0003] 1. When the computer motherboard is manufactured in solid form, the motherboard sheet is manually placed on the surface of the workbench, which is time-consuming and laborious. The motherboard sheet before and after molding is docked on the corresponding position of the workbench surface by manpower, and it cannot be quickly placed. The main board sheet is placed in the corresponding position in advance, and the other one is formed quickly after one main board sheet is formed, and the processing gap is relatively large, which in turn affects the manufacturing efficiency of the computer main board;

[0004] 2. When manually placing the motherboard sheet, it is impossible to accurately place the motherboard sheet at the corresponding position on the workbench, causing the physical molding to deviate from the original position. At the same time, the motherboard sheet is easy to deviate from the original position during the molding process, which affects the computer motherboard. molding quality and efficiency;

[0005] 3. When forming computer motherboards, the workbench used to hold the molded parts needs to be lifted frequently. In the forming equipment, the workbench bears a large weight, the drive reduction ratio is large, and the movement speed of the workbench is very low. Molded parts cannot be separated quickly, and the material belt is easy to wrinkle due to pulling when detached, which affects the efficiency and quality of molding

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