Packaging structure, packaging structure manufacturing method and display panel

Abstract

The embodiment of the invention provides a packaging structure, a packaging structure processing method and a display panel. The packaging structure comprises an organic light-emitting semiconductor device layer, a protective layer, a hydrophobic layer and a packaging layer, and the organic light-emitting semiconductor device layer comprises a first surface and a second surface which are oppositely arranged. The protective layer is arranged on the first surface and is made of a lithium fluoride material. The hydrophobic layer is arranged on one side, far away from the first surface, of the protective layer. The hydrophobic layer is made of an organic material or an inorganic super-hydrophobic film containing a trihydroxy silicon-based active group, and the packaging layer is arranged at one side, far away from the protective layer, of the hydrophobic layer. According to the packaging structure, the hydrophobic layer is arranged so that the water blocking effect of the packaging layer on the organic light-emitting semiconductor device can be enhanced and the service life of the device can be prolonged. The adhesive force between the packaging layer and the film layer of the protective layer can be improved, and the falling of the film layer can be reduced.

Description

technical field [0001] The present application relates to the field of display technology, in particular to a packaging structure, a manufacturing method of the packaging structure, and a display panel. Background technique [0002] With the rapid development of organic light-emitting semiconductor (Organic Light-Emitting Diode, OLED) technology and a large amount of investment in research and development, OLED has gradually entered the stage of mass production and commercial application. OLED devices have many advantages such as full solid state, bendable, fast response, wide viewing angle, self-illumination, ultra-thin and ultra-light. Among them, the bendable feature of OLED devices is the future development trend, and more and more manufacturers have begun to develop and produce bendable screens and complete machine equipment. However, during the continuous bending process, stress concentration and other phenomena will occur in the bending area, and the film layer is mo...

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Problems solved by technology

Usually, under this structure, the inorganic layer blocks water and oxygen in order to ensure strong compactness. However, due to the dense structure of the inorganic layer and the low adhesion with the OLED cathode film layer, the film layer is prone to detachment and fracture.

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