Capacitive coupling plasma etching equipment

Abstract

The invention provides capacitive coupling plasma etching equipment, which is characterized in that a lower electrode is fixed at the lower end of a conductive supporting rod; a telescopic conductivepart is fixed at the lower end of the conductive supporting rod; the telescopic conductive part stretches out and draws back in the axial direction of the conductive supporting rod; and meanwhile, thelower end of the telescopic conductive part is electrically connected with the output end of a radio frequency matcher through an electric connecting part, so that the height of the lower electrode can be controlled through stretching out and drawing back of the telescopic conductive part, and the distance between an upper pole plate and a lower pole plate is adjustable. Meanwhile, the equipmentis further provided with an inner conducting ring at the outer side of the lower electrode, wherein the inner conducting ring is electrically connected with a cavity through the telescopic conductivepart, shielding is formed between a lower electrode of the inner conducting ring and a radio frequency return path in the cavity, and the instability of a radio frequency loop caused by a radio frequency field of the lower electrode in the moving process is avoided, so that the stability of the radio frequency loop is considered while the distance between the pole plates is adjustable.

Description

technical field [0001] The invention relates to the field of semiconductor processing equipment, in particular to a capacitive coupling plasma etching equipment. Background technique [0002] Capacitively coupled plasma processing equipment generates plasma by means of radio frequency coupling discharge, and then uses plasma for deposition, etching and other processing techniques. Among them, the distance between the electrodes that generate plasma is an important parameter, especially In plasma etching equipment, with the continuous improvement of processing technology requirements, different etching steps need to be completed under different electrode plate spacings. However, since the electrode is a part of the radio frequency circuit, when the lower electrode moves, it will cause the instability of the radio frequency signal. To realize the adjustable distance between the plates, it is necessary to take into account the stability of the radio frequency circuit at the sam...

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Problems solved by technology

However, since the electrode is a part of the radio frequency circuit, when the lower electrode moves, it will cause the instability of the radio frequency signal. To realize the adjustable distance between the plates, it is necessary to take into account the stability of the radio frequency circuit at the same time.

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