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Optical module

An optical module and laser technology, applied in the field of optical communication, can solve problems such as affecting the working performance of optical modules, achieve the effects of good optical alignment stability, avoid concentrated heat accumulation, and simplify assembly requirements

Active Publication Date: 2020-06-26
HISENSE BROADBAND MULTIMEDIA TECH
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

And if the heat generated inside the optical module cannot be dissipated in time, it will seriously affect the performance of the optical module

Method used

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Embodiment Construction

[0039] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0040] One of the core links of optical fiber communication is the mutual conversion of optical and electrical signals. Optical fiber communication uses optical signals carrying information to be transmitted in information transmission equipment such as optical fibers / optical waveguides, and the passive transmission characteristics of light in optical fibers / optical waveguides can be used to achieve low-cost, low-loss information transmission; and information proces...

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Abstract

An optical module provided by the invention comprises a circuit board; a base embedded in the circuit board; a laser assembly attached to the base and used for emitting light without carrying signals;a silicon optical chip attached to the base, wherein a third light hole is formed in the silicon optical chip, and light which is emitted by the laser assembly and does not carry signals is receivedthrough the third light hole; and a laser upper cover, wherein the bottom of the laser upper cover is fixedly connected with the base, and the laser upper cover is used for covering the laser assemblyand sealing the laser assembly between the laser upper cover and the base. The invention provides the optical module. The laser assembly and the silicon optical chip are arranged on the base, the laser assembly is sealed through the laser upper cover, and the laser assembly and the silicon optical chip are directly cooled through the base, so that internal heat dissipation of the optical module is facilitated, concentrated accumulation of internal heat of the optical module is avoided, the laser assembly arranged on the base is directly wrapped by the laser upper cover, packaging of the laserassembly is omitted, and packaging of the laser assembly is facilitated.

Description

technical field [0001] The present application relates to the technical field of optical communication, and in particular to an optical module. Background technique [0002] Optical communication technology will be used in new business and application modes such as cloud computing, mobile Internet, and video. In optical communication, the optical module is a tool to realize the mutual conversion of photoelectric signals, and it is one of the key components in optical communication equipment. Among them, the use of silicon photonic chips to realize the photoelectric conversion function has become a mainstream solution adopted by high-speed optical modules. [0003] In the silicon optical module, the silicon optical chip is set on the circuit board, and is electrically connected to the circuit board by bonding; the silicon optical chip is connected to the optical interface of the optical module through an optical fiber ribbon, so that optical signals enter and exit the silico...

Claims

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Application Information

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IPC IPC(8): G02B6/42
CPCG02B6/4268G02B6/428G02B6/4296
Inventor 于帮雨董本正孙祥勋邵乾徐发部
Owner HISENSE BROADBAND MULTIMEDIA TECH
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