108results about How to "Avoid heat accumulation" patented technology

A light-emitting device has a light-emitting device (3), a base body (1) protruding section mounted the light-emitting device (3), a reflection member (2) and a fluorescent material layer (4) disposed with gap to the light-emitting device (3). A cross section of the inner circumferential surface (2a) of the reflection member (2) cut by a virtual plane including a virtual axis (L) penetrating a center of the inner surface and perpendicular to the upper principal surface of the base body (1) has a sectional profile defined by a curved line expressed by the following formula, and the inner surface of the reflection member is a curved surface obtained by rotating the curved line about the virtual axis: Z=(cr<2>) / [1+{1-(1+k)c<2>r<2>] ] <1 / 2>]} (wherein -1<=k<=-0.001, 0.001<=c<=10), r is the radius between the virtual axis and the surface of the inner circumferential surface, Z is the height from the lower end of the inner circumferential surface to the surface of the inner circumferential surface at the radius.

A light emitting diode package includes a silicon substrate having a first surface and a second surface opposite to the first surface, wherein the first surface includes a cavity, a light emitting diode chip fixed on a bottom of the cavity, and a glass lens secured to the silicon substrate and covering the light emitting diode chip.

Provided is a heating resistor element (1), including: an insulating substrate (9); a heat accumulating layer (10) bonded to a surface of the insulating substrate (9); and a heating resistor (11) provided on the heat accumulating layer (10), in which: on at least one of bonded surfaces (9a) between the insulating substrate (9) and the heat accumulating layer (10), at least one of the insulating substrate (9) and the heat accumulating layer (10) is provided with a concave portion (16) in a region opposed to the heating resistor (11) to form a hollow portion (17); and the hollow portion (17) includes an inner surface on a side of the insulating substrate (9), the inner surface being processed to have surface roughness (Ra) of 0.2 μm or more. Accordingly, heat accumulation in a gas of the hollow portion (17) can be suppressed to improve printing quality.

The present invention provides a process of producing unsaturated aldehydes and unsaturated acids from olefins by fixed-bed catalytic partial oxidation in a shell-and-tube heat exchanger-type reactor. In this process, the reactor comprises a first-step reaction zone of mainly producing the unsaturated aldehydes, a second-step reaction zone of mainly producing the unsaturated acids, or both the two zones. The first-step reaction zone is divided into two or more zones by a partition. Each of the divided shell spaces is filled with a heat transfer medium, and the heat transfer medium in each shell space is maintained at isothermal temperature or a temperature difference of 0-5 DEG C. The temperatures of the heat transfer media in each of the divided shell spaces are set to increase in the moving direction of reactants. In order to facilitate the removal of heat generation at a location where the partition is placed, a reaction inhibition layer is disposed in the first-step reaction zone. Also, in order to protect the catalyst layer from a highly exothermic reaction, the process is performed at a limited temperature difference between the temperature in a hot spot and the temperature of a molten salt. If the improved heat control system according to the present invention is used, the heat stability of the catalyst layer will be secured and the yields of intermediate and final products can be increased.

A motor device coil heat dissipation structure is provided. The motor device coil heat dissipation structure includes a motor, a plurality of coils, and a plurality of thermal conduction glues. The motor includes a rotor and a stator. The stator is disposed at an outer periphery of the rotor. The stator includes an iron core assembly. The iron core assembly includes a plurality of winding portions. Each of the winding portions is provided with two winding grooves at two sides thereof. The coils are wound in winding grooves of the winding portions. The thermal conduction glues cover an outer periphery of the coils, and the thermal conduction glues are filled in a plurality of gaps between the coils and the winding grooves.