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High-heat-dissipation-performance tin soldering paste for low-temperature sintering technology and preparation method thereof

A low-temperature sintering and solder paste technology, used in welding equipment, metal processing equipment, welding media, etc., can solve problems affecting product service life, high welding temperature, device damage, etc., to reduce thermal load, improve service life and reliability. the effect of ensuring product quality

Inactive Publication Date: 2020-06-30
深圳市唯特偶新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When using traditional solder for packaging, the solder joint itself needs a higher soldering temperature, for example: the traditional tin-lead solder paste (about 63% tin by weight and about 37% lead by weight) has a soldering peak temperature of about 265°C, without Lead solder paste (about 96.5% by mass of tin, about 3.0% by mass of silver, and about 0.5% by mass of copper) has a soldering peak temperature of about 275-280°C. With the increasing precision of electronic components or chips High, such soldering temperature is very easy to cause damage to the device, thus affecting the service life of the assembled product

Method used

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  • High-heat-dissipation-performance tin soldering paste for low-temperature sintering technology and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] A kind of solder paste with ultra-high heat dissipation performance suitable for low-temperature sintering process and the preparation of test samples are carried out according to the following steps:

[0038] Step 1, prepare component (1) filler: stearic acid amide 4.2Kg, super rosin 10.8Kg, and component (2) dispersant: dioctyl ether 5.0Kg, tetrahydrofurfuryl alcohol 2.5Kg, adipic acid 3.0Kg , ethyl acetate 4.0Kg, high-efficiency surfactant (FT900) 0.5Kg, the above materials are mixed and heated to 110-130 ° C, after the solid materials are all melted, the mixture is stirred and mixed for about 30 minutes to obtain a paste auxiliary agent;

[0039] Step 2, prepare component (3) metal powder: 6337 tin-lead powder (tin 63%, lead 37%) 57Kg, pure silver powder 3.0Kg, pure bismuth powder 6.8Kg, and component (4) diamond powder: diamond powder ( Polycrystalline powder, particle size 1-3 microns, median value 2 microns) 3.2Kg, added to the paste additive prepared in the abo...

Embodiment 2

[0043] A kind of solder paste with ultra-high heat dissipation performance suitable for low-temperature sintering process and the preparation of test samples are carried out according to the following steps:

[0044] Step 1, prepare component (1) filler and component (2) dispersant: stearic acid amide 3.6Kg, super rosin 11.5Kg, dioctyl ether 4.0Kg, tetrahydrofurfuryl alcohol 2.0Kg, adipic acid 3.0Kg, Ethyl acetate 3.2Kg, high-efficiency surfactant (FT900) 0.8Kg, mix the above materials and heat to 110-130°C, after all the solid materials are melted, stir and mix for about 30 minutes to obtain a paste additive ;

[0045] Step 2, prepare component (3) metal powder and component (4) diamond powder: 6337 tin-lead powder (tin 63%, lead 37%) 55Kg, pure silver powder 3.0Kg, pure bismuth powder 6.8Kg, diamond powder (multiple Crystal powder, particle size 1-3 microns, median value 2 microns) 7.1Kg, added to the paste additive prepared in the above step 1 and returned to room temperat...

Embodiment 3

[0049] A kind of solder paste with ultra-high heat dissipation performance suitable for low-temperature sintering process and the preparation of test samples are carried out according to the following steps:

[0050] Step 1, prepare component (1) filler and component (2) dispersant: stearic acid amide 2.5Kg, super rosin 12.0Kg, dioctyl ether 3.0Kg, tetrahydrofurfuryl alcohol 1.5Kg, adipic acid 3.0Kg, Ethyl acetate 3.6Kg, high-efficiency surfactant (FT900) 0.6Kg, mix the above materials and heat to 110-130°C, after all the solid materials are melted, stir and mix for about 30 minutes to obtain a paste additive ;

[0051] Step 2, prepare component (3) metal powder and component (4) diamond powder: 6337 tin-lead powder (tin 63%, lead 37%) 60Kg, pure silver powder 3.0Kg, pure bismuth powder 6.8Kg, diamond powder (multiple Crystal powder, particle size 1-3 microns, median value 2 microns) 4.0Kg, added to the paste additive prepared in the above step 1 and returned to room temperatur...

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Abstract

The invention discloses a high-heat-dissipation-performance tin soldering paste for a low-temperature sintering technology and a preparation method thereof. By means of proportioning of various kindsof fillers, dispersing agents, metal powder and polycrystalline diamond powder, by means of certain technology processing, the super-high-heat-dissipation-performance tin soldering paste with the heatconductivity reaching 550-800 W / m.K can be manufactured. The manufactured product has a super-high heat dissipation coefficient and a low resistivity meeting soldering flux requirements. By the adoption of the obtained high-heat-dissipation-performance tin soldering paste, firstly, the formula and the manufacturing technology are simple; secondly, the work temperature is lower than that of ordinary soldering flux in the encapsulation process, and thermal shock on components is effectively avoided; and in addition, the tin soldering paste has a super-high heat dissipation effect, so that the effect of the soldering flux in the encapsulation process is increased on the basis of the single conducing effect. To a certain extent, the high-heat-dissipation-performance tin soldering paste meetsthe strong demand for the heat dissipation effect of current electronic products and also fills up the technological gap on the aspect of heat dissipation of electronic encapsulation materials.

Description

technical field [0001] The invention relates to a new type of electronic packaging process, which is different from the traditional electronic tin solder welding process, and is sintered and packaged at a lower temperature than the traditional soldering temperature. Solder paste and method of preparation thereof. Background technique [0002] With the development of the electronics industry, the miniaturization, power increase and integration of electronic devices are getting higher and higher. In the actual application process, the heat load of high-power electronic products or components is increasing, and the problem of heat dissipation is becoming more and more prominent. When using traditional solder for packaging, the solder joint itself needs a higher soldering temperature, for example: the traditional tin-lead solder paste (about 63% tin by weight and about 37% lead by weight) has a soldering peak temperature of about 265°C, without Lead solder paste (about 96.5% by...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/363
CPCB23K35/025B23K35/262B23K35/3612B23K35/362
Inventor 吴晶夏杰唐欣李维俊郭万强邓涛刘伟俊
Owner 深圳市唯特偶新材料股份有限公司
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