Optical coupler

Abstract

The present invention relates to an optical coupler comprising: two or more lead frames; an optical channel structure which comprises a light-emitting chip, a light-sensing chip and a light-transmitting inner packaging body, wherein the light-emitting chip and the light-sensing chip are arranged on the lead frame and are coplanar, the light-emitting surface of the light-emitting chip and the light-receiving surface of the light-sensing chip are arranged in the same direction, and the light-transmitting inner packaging body wraps the light-emitting chip and the light-sensing chip; and a light reflection outer packaging body which wraps the light transmission inner packaging body, wherein joint interfaces, making contact with the light transmission inner packaging body, of the light reflection outer packaging body and the light transmission inner packaging body are optical reflection surfaces, the light reflection outer packaging body and the light transmission inner packaging body are of a structure formed through double-material forming and glue sealing forming, and therefore the inner packaging body and the light reflection outer packaging body are easy to shape.

Description

technical field [0001] The invention relates to an electronic component, in particular to an optical coupler. Background technique [0002] An optocoupler is a voltage isolation device that transmits electrical signals between two isolated circuits via optical signals. A conventional photo coupler mainly includes two lead frames electrically isolated from each other, a light-emitting chip disposed on the lead frame, and a photosensitive chip disposed on the other lead frame. The light-emitting chip is driven by the input electrical signal and converts the electrical signal into a light signal, while the photosensitive chip receives the light signal and converts the light signal into an electrical signal for output. [0003] Due to the requirement of high voltage resistance for optocouplers, it is difficult to ensure accurate alignment of each other in the packaging process where the light-emitting chip and the photosensitive chip are opposed, and it is often difficult to en...

AI Technical Summary

Problems solved by technology

[0003] Due to the requirement of high voltage resistance for optocouplers, it is difficult to ensure accurate alignment of each other in the packaging process where the light emitting chip and the photosensitive chip are opposed, and it is often difficult to ensure that all products can meet the high voltage resistance requirement

In the safety requirements of optocoupler products, the product design is required to meet the external creepage distance and internal metal penetration distance, so that the thin series of optocoupler products have poor production yield or failure due to high process difficulty product outflow

The opposite package structure will also cause the product to have high capacitance characteristics. In terms of common mode rejection characteristics, more additional design and cost are often required to avoid interference

In addition, although optocouplers have been widely used in various electrical products, it is difficult to shape the inner package and the outer package in the existing optocoupler, and it is often difficult to seal the inner package and the outer package. In turn, the component characteristics of the optocoupler are affected and cannot meet the application requirements

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