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Laser machining small hole device based on scanning galvanometer

A technology of laser processing and scanning galvanometer, which is applied in the direction of metal processing equipment, laser welding equipment, manufacturing tools, etc., can solve the problems of low processing efficiency, low hole making precision, inconvenient focusing, etc., and achieve strong applicability, reduce Small precision requirements and adjustment links, the effect of improving processing efficiency and processing performance

Active Publication Date: 2021-12-10
AVIC BEIJING AERONAUTICAL MFG TECH RES INST
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Problems solved by technology

[0008] The embodiment of the present invention provides a laser processing small hole device based on the scanning galvanometer, which is used to solve the problem of low processing efficiency, inconvenient focus adjustment and problems of the above-mentioned laser coaxial assisted air blowing process based on the scanning galvanometer. The problem of low hole making precision

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  • Laser machining small hole device based on scanning galvanometer
  • Laser machining small hole device based on scanning galvanometer
  • Laser machining small hole device based on scanning galvanometer

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Embodiment Construction

[0028] Embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings and examples. The detailed description and accompanying drawings of the following embodiments are used to illustrate the principles of the present invention, but cannot be used to limit the scope of the present invention, that is, the present invention is not limited to the described embodiments, without departing from the spirit of the present invention Any modification, substitution and improvement of parts, components and connection methods are covered under.

[0029] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The following will refer to the attached image 3 - attached Figure 4 The present application will be described in detail in conjunction with the embodiments.

[0030] See attached image 3 And attached Figure 4...

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Abstract

The invention relates to a laser processing small hole device based on a scanning galvanometer. Including: a first 45° mirror, a two-dimensional scanning galvanometer unit, a focusing objective lens, a coaxial auxiliary air blowing mechanism and a base; the two-dimensional scanning galvanometer unit, the focusing objective lens, and the coaxial auxiliary air blowing The mechanism is separately installed on the base from top to bottom, and the focusing objective lens and the coaxial auxiliary blowing mechanism move freely in the up and down direction; the two-dimensional scanning galvanometer unit and the first 45 °Reflector is used to adjust the output direction of the laser light to be vertically incident on the center of the focusing objective lens; the coaxial auxiliary air blowing mechanism includes a nozzle seat and a nozzle arranged at the lower end of the nozzle seat, and the nozzle is horizontal The direction is free to move. The device of the invention improves the efficiency of processing small holes with larger depths through the effective adjustment of the laser defocusing position, the axial precision of the small holes is higher, and is conducive to the miniaturization of the size of the coaxial blowing nozzle at the front end of the processing device.

Description

technical field [0001] The invention relates to the technical field of laser processing, in particular to a small hole laser processing device based on a scanning vibrating mirror. Background technique [0002] Since ultrafast laser processing with picosecond and femtosecond pulse widths has less thermal influence, the quality of processed small holes is significantly better than that of millisecond long pulse laser processing. Therefore, it has been increasingly used in the processing of small holes with larger depths. [0003] In order to improve the quality and efficiency of processing small holes with larger depths, a method of filling processing has appeared in related technologies. figure 1 Shown is an example of filling a machined small hole with multiple concentric circles, and coaxial auxiliary blowing during machining, for example, with figure 2 It is a schematic diagram showing that the picosecond laser has been successfully applied to the processing of small fu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/36B23K26/382B23K26/082B23K26/14B23K26/064
CPCB23K26/36B23K26/382B23K26/082B23K26/14B23K26/064B23K26/0643B23K26/0648
Inventor 张晓兵纪亮焦佳能蔡敏张伟李元成毛忠
Owner AVIC BEIJING AERONAUTICAL MFG TECH RES INST
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