Laser machining small hole device based on scanning galvanometer

Abstract

The invention relates to a laser processing small hole device based on a scanning galvanometer. Including: a first 45° mirror, a two-dimensional scanning galvanometer unit, a focusing objective lens, a coaxial auxiliary air blowing mechanism and a base; the two-dimensional scanning galvanometer unit, the focusing objective lens, and the coaxial auxiliary air blowing The mechanism is separately installed on the base from top to bottom, and the focusing objective lens and the coaxial auxiliary blowing mechanism move freely in the up and down direction; the two-dimensional scanning galvanometer unit and the first 45 °Reflector is used to adjust the output direction of the laser light to be vertically incident on the center of the focusing objective lens; the coaxial auxiliary air blowing mechanism includes a nozzle seat and a nozzle arranged at the lower end of the nozzle seat, and the nozzle is horizontal The direction is free to move. The device of the invention improves the efficiency of processing small holes with larger depths through the effective adjustment of the laser defocusing position, the axial precision of the small holes is higher, and is conducive to the miniaturization of the size of the coaxial blowing nozzle at the front end of the processing device.

Description

technical field [0001] The invention relates to the technical field of laser processing, in particular to a small hole laser processing device based on a scanning vibrating mirror. Background technique [0002] Since ultrafast laser processing with picosecond and femtosecond pulse widths has less thermal influence, the quality of processed small holes is significantly better than that of millisecond long pulse laser processing. Therefore, it has been increasingly used in the processing of small holes with larger depths. [0003] In order to improve the quality and efficiency of processing small holes with larger depths, a method of filling processing has appeared in related technologies. figure 1 Shown is an example of filling a machined small hole with multiple concentric circles, and coaxial auxiliary blowing during machining, for example, with figure 2 It is a schematic diagram showing that the picosecond laser has been successfully applied to the processing of small fu...

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Problems solved by technology

[0008] The embodiment of the present invention provides a laser processing small hole device based on the scanning galvanometer, which is used to solve the problem of low processing efficiency, inconvenient focus adjustment and problems of the above-mentioned laser coaxial assisted air blowing process based on the scanning galvanometer. The problem of low hole making precision

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